Idaho Microfabrication Lab
Idaho Microfabrication Lab (IML)
Lab Location
Boise State University
Boise, Idaho
Staff
Pete Miranda
Director
pmiranda@boisestate.edu
(208) 426-5713
Travis Gabel
Technical Support Engineer
travisgabel@boisestate.edu
(208) 426-4646
Expertise & Research
The IML consists of a 900 square foot Class 1000 clean room, a 1500 square foot process lab, and a 900 square foot metrology lab. The IML is equipped to fabricate microelectronic devices using various thin film deposition techniques, chemical processing, photolithography, and plasma etching. Characterization of many different types of materials can also be accomplished along with access to the Boise State Surface Science Lab and the Boise State Center for Materials Characterization.
Contracting Work
Work in this lab is contracted through the iLabs portal. You can learn more about iLabs by clicking here or contacting the lab director.
| Asset | Mfr and Model | Field | Application |
|---|---|---|---|
| Industrial Inkjet Printer | Fuji Film Dimatix | Additive Manufacturing, Materials, Deposition | High resolution deposition of fluidic materials over a varying materials, thickness and location. Deposition of biological fluids including cell patterning, DNA arrays and proteomics allowing features down to 20 microns. |
| Industrial Inkjet Printer | Nscrypt 150-3Dn-HP | Additive Manufacturing | High resolution printer that provides micro-dispensing, 3D printing, laser micro machining, sintering, curing or heating, pick and place, micro-milling, UV curing, mapping and vision. inks, epoxies, solders, conductive pastes and dielectric paste as a short list of materials. Applications include micro-electronic packaging, resistive devices, heater coils, printed antennas, printed electronics, ceramic structures, heterogeneous mixtures. |
| Benchtop Electronics Printer | Optomec Aerosol Jet (AJ) 200 | Additive Manufacturing | Enables printing of interconnects on both 2D and 3D substrates on devices up to 200mm x 200mm with an accuracy of 25 microns. |
| Pulsed Light Electronics Printer | Xenon S2100 Flash Sintering System | Additive Manufacturing | Evaluate the sintering characteristics of UV light curable nano inks in both research and low volume printing environments. |
| Thin Film Ellipsometer | J.A. Woollam M-2000 Spectroscopic Ellipsometer | Semiconductor Characterization and Metrology | Measuerment of film thickness and refractive index of thin films supporting up to 200 mm wafer size. |
| Thin Film Thickness Measurment System | Nanometrics NanoSpec 212 | Semiconductor Characterization and Metrology | Measures thickness of thin films of semiconductors. |
| Stylus Profilometer | Bruker Dektax XT-A | Semiconductor Characterization and Metrology | 3D mapping of semiconductor devices and materials. |
| Optical Profiler | Wyko / Veeco NT1100 | Semiconductor Characterization and Metrology | Large scale non- contact surface metrology for MEMS, thick films, optics, ceramics & advanced materials for nano and microscale devices. |
| Sputtering Machine | AJA International Orion 5 | Materials Deposition | Physical vapor deposition system with RF and DC target sputtering capability. 100mm tooling, heated substrate, load lock, film thickness monitor, substrate biasing. |
| Benchtop Sputterer | Sputter Sciences CrC-150 | Materials Deposition | Deposits various metal films uniformly on a targets up to 2 inches wide and wafers up to 150 mm in diameter. |
| Thermal Evaporator | CHA 600 | Materials Deposition | Evaporate thin films up to 1500 nanometers thick. Can accommodate up to three 8? wafers simultaneously and up to three different layers may be evaporated in one run. |
| Plasma Etcher | Oxford PlasmaLab 180 ICP with Bosch Etch (fluorine-based) | Materials Plasma Etching | Etching semiconductor materials using reactive ion, BOSCH, silicon nitride, silicon cryo, silicon dioxide and metal etching processes. Can accommodate varying wafer sizes. |
| Reactant Ion Etcher | Branson Asher Dionex 3000 | Materials Plasma Etching | Etching semiconductor films and removing photo-resist using reactive ion oxygen-based etching processes. |
| Ion Mill | Veeco ME-1001 | Materials Plasma Etching | Argon plasma ion beam milling system for microelectronics patterning. Water-cooled substrate holder up to 200mm wafer sizes. |
| Plasma Processing System | PVA TePla Ion 40 | Materials Plasma Etching | Batch-mode plasma system for etch, strip, clean, and surface treatment of wafers up to 150mm. |
| Acid Station with RCA clean | JST Manufacturing | Surface Chemistry/Wet Processing | RCA cleaning and Piranha cleaning of silicon wafers. |
| General Base Station | JST Manufacturing | Surface Chemistry/Wet Processing | Processing of base chemistries in cleanroom including photoresist developer and stripper, potassium hydroxide, ammonium hydroxide and other chemicals. |
| Solvent Processing Station | JST Manufacturing | Surface Chemistry/Wet Processing | Used for processing solvent chemistries in the IML cleanroom. Equipped with a spin coat station and hot plate for soft back out of spun on materials. |
| Spin Rinse Dryer | SemiTool ST-460 | Surface Chemistry/Wet Processing | Provides deionized water rinsing and nitrogen drying of silicon wafers and removal of surface contaminants on 100mm wafers. |
| Contact Aligner | Quintel Q-4000 | Photolithography | UV light source patterning with contact or proximity printing. Use with mask geometries of 5x5x90mil. 1 micron resolution. |
| Contact Aligner | OAI 5000 | Photolithography | Provides production scale mask alignment on semiconductor materials as successive layers are processed to 0.1 micron precision. Includes robot wafer transfer system. |
| Spin Coater | CEE Model 200X-F integrated with solvent processing station) | Photolithography | May be used to apply photoresist and other coatings to semiconductor materials. This tool is incorporated into the JST solvent bench. |
| Thermal Oxidation/Diffusion Furnace | MiniBrute MB-80 | Semiconductor Thermal Processing | Provides thermal oxidation (up to 1200C) for N-type dopant diffusion for wafers up to 100mm. |
| Modular Process Technology RTP-600s Rapid Thermal Annealer | Modular Process Technology RTP-600s Rapid Thermal Annealer | Semiconductor Thermal Processing | Benchtop rapid thermal processing system with multi-gas capabilities and support of wafers up to 6? in diameter. Can be used for implant activation, contact alloying and silicide formation. |
| Blue Electric SV-57A Vacuum Oven | Blue Electric SV-57A Vacuum Oven | Semiconductor Thermal Processing | Vacuum capable oven used for various applications in semiconductor processing up to 150C for wafers up to 100mm |
| Environmental Chambers | Various | Semiconductor Thermal Processing | Can operate up to 300C in varying environments including vacuum. |
| Programmable Hot Plates | Programmable Hot Plates (Integrated With Each of Three JST Chemical Processing Stations) | Semiconductor Thermal Processing | Facilitate drying of liquids on semiconductors at chemical processing stations. This tool is incorporated into the JST benches. |
| Wire Bonding System | WestBond Model 7476 | Electronic Packaging | Manual bonding of aluminum or gold wires ranging from 18-50 micron in diameter to semiconductor devices. |
| Wedge Bonding System | K&S Model 4526 | Electronic Packaging | Manual bonding of aluminum or gold wires ranging from 18-75 micron in diameter to semiconductor devices. |
| Wafer Dicer | ADT982-6 | Electronic Packaging | Enables sawing of semiconductor wafer into discrete devices. |