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Seminar November 2: American Semiconductor, America’s OSAT “Technically Solving the Demand for Advanced/Thin IC Packaging”

November 2 @ 10:30 am - 11:30 am

Join us for seminar on Wednesday, November 2! Doug Hackler is scheduled to present about American Semiconductor and advanced packaging today for thin electronic devices. Participate in person at the Micron Engineering Center, room 114 or join us on Zoom.

 

Presentation Abstract

This is an overview of American Semiconductor and advanced packaging today for thin electronic devices. This presentation includes an industry overview, introduction to OSAT packaging, assembly and test, reliability testing of thin devices, and comments regarding characteristics that improve the probability of winning a semiconductor industry job.

 

Bio

Douglas Hackler, Co-founded American Semiconductor in 2001 and is currently bringing up a new 300mm Semiconductor-on-Polymer WLCSP facility in Boise. Doug’s team demonstrated the industry’s first commercial physically flexible bulk CMOS SOC in 2017 and has multiple patents and patents pending for conventional and flexible solid state technology. At American Semiconductor Doug serves as President and CEO performing overall corporate and operational responsibilities.