
The 3D-PFLOPS: 3D Integrated Parallel Fabrics enabling Layered Opto-electronic Processors for Near-memory AI Computing project develops a new heterogeneous computer architecture that combines electronics and photonics to make artificial intelligence systems dramatically more energy-efficient. By keeping computation close to memory and routing each phase of an AI workload to the hardware best suited for it, the design overcomes the data-movement, power, and thermal bottlenecks that limit today’s AI accelerators.
- PI: Dr Omiya Hassan
- Co-PIs: Dr Karthik Srinivasan and Dr Purab Ranjan Sutradhar
- Awarded by: US National Science Foundation (NSF)
- Award Number: 2615713 | Award Details
Project Goals

Electro-Optical application-specific integrated circuit (EOASIC)
Lead: Dr Hassan & Dr Srinivasan
Design a simulation framework for CMOS and photonics processing elements (PE) as training and inference engines.
We are currently hiring graduate research assistants (GRA) for the photonics section of the proposal. Reach out to the designated leads. (US citizen preferred)

Thermal modeling of 3D Heterogeneous AI Engines
Lead: Dr Hassan, Dr Srinivasan & Dr Sutradhar
Verifying the physical feasibility and scalability of the 3D-PFLOPS architecture and designing an architecture-specific thermal model.

Near-Memory Multiprocessing System
Lead: Dr Sutradhar & Dr Hassan
Develop a Gem5X-based system-level simulation framework which integrates all three dies into a near-memory heterogeneous computing architecture.
We are currently hiring graduate research assistants (GRA) for the near-memory systems section of the proposal. Reach out to the designated leads.
We are open to collaborations; please reach out to the PI of this project or designated project goal leads for more information.
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