{"id":15,"date":"2022-12-01T12:53:39","date_gmt":"2022-12-01T19:53:39","guid":{"rendered":"https:\/\/www.boisestate.edu\/coen-bsmer\/?page_id=15"},"modified":"2026-02-24T10:25:50","modified_gmt":"2026-02-24T17:25:50","slug":"about-microelectronics-education-and-research","status":"publish","type":"page","link":"https:\/\/www.boisestate.edu\/microelectronics\/about-microelectronics-education-and-research\/","title":{"rendered":"About"},"content":{"rendered":"\n\n\t<div class=\"panel s-wrapper site-panel site-panel--interstitial has_image site-panel-colorway-orange  top-padding--remove_padding bottom-padding--add_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"interstitial\"\n         \n         data-modular-content>\n    \n\t    <div class=\"interstitial-panel__wrapper has_image\">\n\n\t\n\t\n                    <div class=\"interstitial-panel__img-wrapper l-container--thin\">\n                \n<div >\n\t\t<div  aria-label=\"Someone working with breadboard\" role=\"img\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2026\/02\/D_1712_024_009-2.jpg');\"  class=\"interstitial-panel__img\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n                <div class=\"interstitial-panel__img-caption-wrapper l-container--inner\">\n                    \n                <\/div>\n            <\/div>\n        \n        <div class=\"l-container interstitial-panel__content-wrapper interstitial-panel__content-block--stacked t-content \">\n                            <div class=\"interstitial-panel__img-caption-wrapper l-container--inner\">\n                    \n                <\/div>\n                        <div class=\"l-content--inner\">\n                \n<div class=\"c-content-block interstitial-panel__content-block\">\n\n\t<div class=\"c-content-block__content interstitial-panel__content-inner\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title s-title h2\"\n\t\t>\n\n\tVision\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"interstitial-panel__description\" >\n\t<p><span style=\"font-weight: 400\">The Microelectronics Education and Research Center will be the central hub for microelectronic innovation, entrepreneurship, and workforce development in Idaho.<\/span><\/p>\n<h2>Mission<\/h2>\n<p><span style=\"font-weight: 400\">MERC will create an ecosystem of use-inspired research, private and public partnership, and innovation to drive leading-edge microelectronic technologies.\u00a0<\/span><\/p>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n            <\/div>\n        <\/div>\n\n\t\n\t\t\t\t\n\t    <\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t\t<div class=\"s-wrapper site-panel site-panel--statsgrid stat-panel-bg--grey top-padding--add_padding bottom-padding--add_padding\"\n\t\tdata-index=\"\"\n\t\tdata-js=\"panel\"\n\t\tdata-type=\"statsgrid\"\n\t\t\n\t\tdata-modular-content>\n\n\t\n\t<div class=\"l-content--outer\">\n\t\t<div class=\"l-content--inner site-panel--statsgrid--inline l-container--inner\">\n\n\t\n            <header class=\"s-header \">\n\n\t\t\t<div class=\"header-titles\">\n\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title s-title h2\"\n\t\t>\n\n\tSemiconductors in Idaho\n\n<\/h2>\n\t\t\t\t\n\t\t\t<\/div>\n\n\t\t\t<div class=\"header-description\">\n\t\t\t\t\t\t\t\t\t\n<div class=\"site-panel__description s-desc t-content\" >\n\t<p><a class=\"c-btn c-btn--sm\" href=\"https:\/\/www.semiconductors.org\/wp-content\/uploads\/2019\/04\/Idaho-2019-Final.pdf\" target=\"_blank\" rel=\"noopener\">Semiconductors in Idaho<\/a><\/p>\n\n<\/div>\n\n\t\t\t\t\t\t\t<\/div>\n\n        <\/header>\n    \n\n\t\n    <div class=\"s-content\">\n        <div class=\"g-row g-row--col-2 g-row--col-3--min-full\"\n             data-depth=\"0\"\n             data-name=\"cards\"\n             data-livetext>\n\n                            <div class=\"g-col\">\n                    \n<div class=\"c-card\">\n\n\t\n\t<span >\n\t\t\t<\/span>\n\n            <i class=\"c-card__icon c-card__icon--arrow\"><\/i>\n    \n\t<div class=\"c-card__content\" >\n\n        \n            \n                            \n<h3\n\t\tclass=\"c-card__title\"\n\t\t>\n\n\t11,417\n\n<\/h3>\n            \n            \n                            \n<div class=\"c-cta__content\" >\n\tPeople employed in the semiconductor industry in Idaho\r\n\n<\/div>\n\n            \n            \n        \n\t<\/div>\n\n\t\n<\/div>\n\n                <\/div>\n                            <div class=\"g-col\">\n                    \n<div class=\"c-card\">\n\n\t\n\t<span >\n\t\t\t<\/span>\n\n            <i class=\"c-card__icon c-card__icon--arrow\"><\/i>\n    \n\t<div class=\"c-card__content\" >\n\n        \n            \n                            \n<h3\n\t\tclass=\"c-card__title\"\n\t\t>\n\n\t33\n\n<\/h3>\n            \n            \n                            \n<div class=\"c-cta__content\" >\n\tSemiconductor companies in Idaho\r\n\n<\/div>\n\n            \n            \n        \n\t<\/div>\n\n\t\n<\/div>\n\n                <\/div>\n                            <div class=\"g-col\">\n                    \n<div class=\"c-card\">\n\n\t\n\t<span >\n\t\t\t<\/span>\n\n            <i class=\"c-card__icon c-card__icon--arrow\"><\/i>\n    \n\t<div class=\"c-card__content\" >\n\n        \n            \n                            \n<h3\n\t\tclass=\"c-card__title\"\n\t\t>\n\n\t$4.5 Bil\n\n<\/h3>\n            \n            \n                            \n<div class=\"c-cta__content\" >\n\tWage impact of semiconductor manufacturers \n<\/div>\n\n            \n            \n        \n\t<\/div>\n\n\t\n<\/div>\n\n                <\/div>\n            \n        <\/div>\n    <\/div>\n\n\n\t\t\t\t\n\t\t<\/div>\n<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--imagetext site-panel-colorway-blue top-padding--add_padding bottom-padding--add_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"imagetext\"\n  \t\t \n         data-modular-content>\n    \n\t<div class=\"panel-imagetext\">\n\t<div class=\"l-container--thin\">\n\t\t\n\t\n\t\n\t\t\t<div class=\"g-row g-row--no-gutters g-row--col-2--min-full g-row--reorder-2-col\">\n\n\t\t\t\t<div class=\"g-col\">\n\t\t\t\t\t\n<div class=\"c-image site-panel__imgtxt-image\">\n\t\t<div  aria-label=\"Campus scene, angled street view of Alumni and Friends Center\" role=\"img\" data-expand=\"200\"   data-sizes=\"auto\" data-bgset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/D_1706_037_013-768x512.jpg 768w 512h, \nhttps:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/D_1706_037_013-1024x683.jpg 1024w 683h\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/themes\/core\/img\/theme\/shims\/large.png');\"  class=\"c-image__bg lazyload\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\n\t\t\t\t<div class=\"g-col\">\n\t\t\t\t\t<div class=\"site-panel__imgtxt-content\">\n\t\t\t\t\t\t\n<div class=\"c-content-block\">\n\n\t<div class=\"c-content-block__content\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title site-panel__imgtxt-panel-title s-title h2\"\n\t\t>\n\n\tMERC\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"site-panel__imgtxt-panel-description t-content\" >\n\t<p>University-wide, multidisciplinary, and connecting government and industry partners with Boise State colleges and departments to:<\/p>\n<ul>\n<li>Ensure the success of students from all backgrounds in microelectronics fields.<\/li>\n<li><a href=\"https:\/\/www.boisestate.edu\/microelectronics\/advancing-your-knowledge\/\"><strong>Establish curriculum<\/strong><\/a>\u00a0that is relevant and cutting-edge with innovative pathways.<\/li>\n<li>Forge connections between <a href=\"https:\/\/www.boisestate.edu\/microelectronics\/in-the-community\/\">K-12 classrooms<\/a>, university education, and the workforce in relation to semiconductors.<\/li>\n<li>Advance research in microelectronics and\u00a0STEM education.\n<div class=\"mceTemp\"><\/div>\n<\/li>\n<\/ul>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\n\t\t\t<\/div>\n\n\t\t\n\t\t\t\t\n\t\t<\/div>\n<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--modal top-padding--add_padding bottom-padding--remove_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"modal\"\n\t\t \n\n         data-modular-content>\n    \n\t\t\t<div class=\"site-panel__gallery-modal-wrapper\" data-js=\"gallery-modal-panel\">\n\t\t<div class=\"l-container site-panel__gallery-modal-inner\">\n\t\t\t<div class=\"l-container l-container--boxed-background\">\n\t\t\t\t<div class=\"site-panel--boxed-background\"><\/div>\n\t\t\t<\/div>\n\t\t\t<div class=\"l-container--inner\">\n\n\t\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"s-content site-panel__gallery-modal-content\">\n\t\t\t\t\t\t\t<div class=\"s-content site-panel__gallery-modal-preview\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n<div class=\"site-panel__gallery-modal-preview-image\">\n\t\t<div  aria-label=\"Microelectronics group at a presentation table\" role=\"img\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-42-1-1024x808.jpg');\"  class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n<div class=\"site-panel__gallery-modal-preview-image\">\n\t\t<div  aria-label=\"Photo 2\" role=\"img\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/D_1706_037_006-1024x683.jpg');\"  class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n<div class=\"site-panel__gallery-modal-preview-image\">\n\t\t<div  aria-label=\"Photo 1\" role=\"img\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/pexels-alessandro-oliverio-611273-1472443-1024x683.jpg');\"  class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<header class=\"s-header site-panel__gallery-modal-header\">\n\n\t\t                <span class=\"site-panel__accent-title\">\n\t\t                    \n\t\t                <\/span>\n\n\t\t\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title h2 site-panel__gallery-modal-title\"\n\t\t>\n\n\tCreation of the Center\n\n<\/h2>\n\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n<div class=\"s-desc t-content para-sm\" >\n\t<p>The CHIPS Act and Science Act was created to bring semiconductor manufacturing and jobs back to the United States.\u00a0 This act, as well as numerous investments and grants, led to the establishment of Boise State University&#8217;s MERC.\u00a0 The purpose is diverse: create education pathways in <a href=\"https:\/\/www.boisestate.edu\/microelectronics\/in-the-community\/\">K-12 schools<\/a> and <a href=\"https:\/\/www.boisestate.edu\/microelectronics\/advancing-your-knowledge\/\">universities<\/a>, prepare students for the workforce, collaborate with industry partners, and advance global semiconductor research and education.<\/p>\n<p>Through <a href=\"https:\/\/www.boisestate.edu\/microelectronics\/industry-advisory-board\/\">industry partnerships<\/a>, investments, and collaboration, MERC continually works to support this nation-wide initiative.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\n<button class=\" c-btn c-btn-sm site-panel__gallery-trigger\"\n\t\ttype=\"button\"\n\t\t\t\ttype='button' aria-label='View Gallery' data-js='gallery-modal-trigger'>\n\t\t\t<span class=\"c-btn__text\">View Gallery<\/span>\n\t<\/button>\n\n\n\t\t\t\t\t\t<\/header>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<script data-js=\"\" type=\"text\/template\" data-script=\"gallery-dialog-script\">\n\t\t\t\t\t\t<div class=\"site-panel__gallery-modal-gallery\" data-js=\"gallery-modal\">\n\t\t\t\t\t\t\t\n<span\n\t\tclass=\"gallery-modal__dialog-title\"\n\t\t>\n\n\tCreation of the Center\n\n<\/span>\n\t\t\t\t\t\t\t<div class=\"l-container--inner--no-padding\">\n\t\t\t\t\t\t\t\t\n<div class=\"c-slider site-panel__gallery-modal-slider\">\n\t<div class=\"c-slider__main swiper-container c-slider__main--has-arrows\" data-js='c-slider'>\n\t\t<div class=\"c-slider__wrapper swiper-wrapper\">\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Microelectronics group at a presentation table\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-42-1-1024x808.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-42-1.jpg 1198w 945h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">1\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Photo 2\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/D_1706_037_006-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/D_1706_037_006.jpg 1800w 1200h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">2\/26: Street view of Boise State Alumni and Friends Center<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Photo 1\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/pexels-alessandro-oliverio-611273-1472443-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/pexels-alessandro-oliverio-611273-1472443-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">3\/26: Generic image of circuitry and microchips.<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/SemiconductorCareerConnections-49-1-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/SemiconductorCareerConnections-49-1-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">4\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-13-1024x768.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-13.jpg 1260w 945h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">5\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Photo 5\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/kydiamu9-1-1024x917.png\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/kydiamu9-1.png 3376w 3024h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">6\/26: The hands of two different students working with circuitry games and gadgets<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/SemiconductorCareerConnections-42-1-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/SemiconductorCareerConnections-42-1-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">7\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-48-1-1024x756.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-48-1.jpg 1280w 945h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">8\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-21-1024x768.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-21.jpg 1260w 945h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">9\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Photo 6\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/jb3.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/jb3.jpg 347w 520h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">10\/26: Four men in suits standing in a lab and discussing.<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-2.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/0-2.jpg 709w 945h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">11\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_7493-1024x768.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_7493-scaled.jpg 2560w 1920h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">12\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Photo 7\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/03\/Anil-and-Microchannel-Plates-1600x900-1.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/03\/Anil-and-Microchannel-Plates-1600x900-1.jpg 534w 300h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">13\/26: Argonne senior scientist holds a 300 mm silicon wafer with atomic layer deposition instrument in the background.<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Photo 3\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/03\/D_2402_034_368-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/03\/D_2402_034_368-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">14\/26: Three people stand in the foreground of a banner saying Institute for Microelectronics Education and Research<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/D_2410_051_185-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/D_2410_051_185-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">15\/26: MER Institute, UPWARDS for the Future, Tokyo Electron, Micron, October 21, 2024, Photo by Luan Teed<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Photo 8\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/pexels-www-erzetich-com-2628105-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/pexels-www-erzetich-com-2628105-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">16\/26: Generic image of circuitry and someone soldering<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Photo 10\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/unnamed-2-1-1024x768.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/unnamed-2-1-scaled-e1723735652308.jpg 644w 483h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">17\/26: MER Outreach coordinator working with three students at desks who are working on circuitry materials<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/SemiconductorCareerConnections-48-1-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/09\/SemiconductorCareerConnections-48-1-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">18\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_9128-1024x768.jpeg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_9128-scaled.jpeg 2560w 1920h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">19\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/527627D5-1D2B-4940-B1A1-0DF150292914_1_105_c-1.jpeg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/527627D5-1D2B-4940-B1A1-0DF150292914_1_105_c-1.jpeg 1024w 768h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">20\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_7474-1024x768.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_7474-scaled.jpg 2560w 1920h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">21\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_7538-1024x768.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_7538.jpg 2016w 1512h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">22\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_9264-1024x768.jpeg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_9264-scaled.jpeg 2560w 1920h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">23\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_9083-1024x756.jpeg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/IMG_9083-scaled.jpeg 2560w 1889h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">24\/26 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/D_2410_051_020-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/D_2410_051_020-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">25\/26: MER Institute, UPWARDS for the Future, Tokyo Electron, Micron, October 21, 2024, Photo by Luan Teed<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/D_2410_051_175-1-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/12\/D_2410_051_175-1-scaled.jpg 2560w 1706h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">26\/26: MER Institute, UPWARDS for the Future, Tokyo Electron, Micron, October 21, 2024, Photo by Luan Teed<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\n\t\t\t\t\t<div class=\"c-slider__arrows\">\n\t\t\t\t<div class=\"c-slider__button c-slider__button--prev swiper-button-prev\"><\/div>\n\t\t\t\t<div class=\"c-slider__button c-slider__button--next swiper-button-next\"><\/div>\n\t\t\t<\/div>\n\t\t\t<\/div>\n\t \n<\/div>\n\n\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/script>\n\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t<\/div>\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--imagetext site-panel-colorway-blue top-padding--remove_padding bottom-padding--add_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"imagetext\"\n  \t\t \n         data-modular-content>\n    \n\t<div class=\"panel-imagetext\">\n\t<div class=\"l-container--thin\">\n\t\t\n\t\n\t\n\t\t\t<div class=\"g-row g-row--no-gutters g-row--col-2--min-full \">\n\n\t\t\t\t<div class=\"g-col\">\n\t\t\t\t\t\n<div class=\"c-image site-panel__imgtxt-image\">\n\t\t<div  aria-label=\"Boise state B\" role=\"img\" data-expand=\"200\"   data-sizes=\"auto\" data-bgset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/00-sillouette-b-1-scaled-e1723828734700-768x602.jpg 768w 602h, \nhttps:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/00-sillouette-b-1-scaled-e1723828734700-1024x802.jpg 1024w 802h\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/themes\/core\/img\/theme\/shims\/large.png');\"  class=\"c-image__bg lazyload\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\n\t\t\t\t<div class=\"g-col\">\n\t\t\t\t\t<div class=\"site-panel__imgtxt-content\">\n\t\t\t\t\t\t\n<div class=\"c-content-block\">\n\n\t<div class=\"c-content-block__content\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title site-panel__imgtxt-panel-title s-title h2\"\n\t\t>\n\n\tThe CHIPS Act\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"site-panel__imgtxt-panel-description t-content\" >\n\t<p>The idea for MERC began with <strong>The Creating Helpful Incentives to Produce Semiconductors <a href=\"https:\/\/new.nsf.gov\/chips#:~:text=About%20the%20%22CHIPS%20and%20Science%20Act%22&amp;text=On%20August%209%2C%202022%2C%20President,use%2Dinspired%2C%20translational%20research.\" target=\"_blank\" rel=\"noopener\">(CHIPS)<\/a> and Science Act, <\/strong>passed and funded by Congress in 2022.<\/p>\n<p>This act presents a once in a generation opportunity for Boise State University, the state of Idaho, and the Nation.<\/p>\n<p>Investments from this act will boost domestic semiconductor research, development, and production, ensuring the United States leads in technology used in everything from mobile phones to defense systems.<\/p>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\n\t\t\t<\/div>\n\n\t\t\n\t\t\t\t\n\t\t<\/div>\n<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n<div style=\"height:100px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":2291,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-15","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/15","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/users\/2291"}],"replies":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/comments?post=15"}],"version-history":[{"count":70,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/15\/revisions"}],"predecessor-version":[{"id":2958,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/15\/revisions\/2958"}],"wp:attachment":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media?parent=15"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}