{"id":2941,"date":"2026-02-24T10:58:15","date_gmt":"2026-02-24T17:58:15","guid":{"rendered":"https:\/\/www.boisestate.edu\/microelectronics\/?page_id=2941"},"modified":"2026-05-04T15:02:50","modified_gmt":"2026-05-04T21:02:50","slug":"summit","status":"publish","type":"page","link":"https:\/\/www.boisestate.edu\/microelectronics\/summit\/","title":{"rendered":"SUMMIT 2026"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\" id=\"h-summit\">SUMMIT<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">SUMMIT is an <strong>8-week immersive summer program<\/strong> designed to give undergraduate students hands-on experience in two tracks: microelectronics circuit and system design, fabrication, and testing (starting summer 2026) and semiconductor processing and microfabrication (coming summer 2027).<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Participants will have the opportunity for industry tours and<br>networking\/interactions with faculty and microelectronics industry professionals.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>All learning in SUMMIT will prepare you for college and your career through a mix of technical instruction, hands-on labs, and collaborative real-world projects led by faculty and industry professionals.<\/strong><\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\" \/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-microelectronics-track-topics-include\">Microelectronics Track Topics Include:<\/h2>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<ul class=\"wp-block-list\">\n<li>Fundamentals of electric circuits and components<\/li>\n\n\n\n<li>Software and simulation tools including SPICE, KiCad, Cadence, and others<\/li>\n\n\n\n<li>Digital logic, programming, and microcontroller systems<\/li>\n<\/ul>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<ul class=\"wp-block-list\">\n<li>Reverse engineering, PCB design and constructions\/soldering, component selection and datasheets, and more<\/li>\n\n\n\n<li>Basic semiconductor device physics (transistors, diodes, etc.)<\/li>\n\n\n\n<li>Integrated circuit design flow, layout, and electrical testing\/validation<\/li>\n<\/ul>\n<\/div>\n<\/div>\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--interstitial  site-panel-colorway-blue interstitial-panel__wrap--bottom top-padding--remove_padding bottom-padding--remove_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"interstitial\"\n         \n         data-modular-content>\n    \n\t    <div class=\"interstitial-panel__wrapper \">\n\n\t\n\t\n        \n        <div class=\"l-container interstitial-panel__content-wrapper interstitial-panel__content-block--bottom t-content \">\n                        <div class=\"l-content--inner\">\n                \n<div class=\"c-content-block interstitial-panel__content-block\">\n\n\t<div class=\"c-content-block__content interstitial-panel__content-inner\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title s-title h2\"\n\t\t>\n\n\tWho Should Apply to SUMMIT?\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"interstitial-panel__description\" >\n\t<ol>\n<li><strong>Community college transfers<\/strong> and <strong>incoming Boise State freshman<\/strong> interested in electrical and computer engineering<\/li>\n<li><strong>Current ECE students entering Freshman or Sophomore year<\/strong> (from Boise State or partnering institutions)<\/li>\n<li><strong>Non-ECE majors entering Sophomore or Junior year<\/strong> who want experience<\/li>\n<\/ol>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n            <\/div>\n        <\/div>\n\n\t\n\t\t\t\t\n\t    <\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--interstitial  site-panel-colorway-orange interstitial-panel__wrap--bottom top-padding--remove_padding bottom-padding--remove_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"interstitial\"\n         \n         data-modular-content>\n    \n\t    <div class=\"interstitial-panel__wrapper \">\n\n\t\n\t\n        \n        <div class=\"l-container interstitial-panel__content-wrapper interstitial-panel__content-block--bottom t-content \">\n                        <div class=\"l-content--inner\">\n                \n<div class=\"c-content-block interstitial-panel__content-block\">\n\n\t<div class=\"c-content-block__content interstitial-panel__content-inner\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title s-title h2\"\n\t\t>\n\n\tImportant Details\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"interstitial-panel__description\" >\n\t<ul>\n<li>Runs June 1-July 24, 2026; approximately 35 hours\/week commitment<\/li>\n<li>Earn one to six course credits in Electrical and Computer Engineering (ECE 297 or 397)<\/li>\n<li>$2000 course enrollment fee applies but will be waived for stipend recipients and other eligible applicants<\/li>\n<li><strong>Stipends up to $5,000 available for select applicants ($4,000 for those<\/strong> <strong>requiring on-campus housing)<\/strong><\/li>\n<\/ul>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n            <\/div>\n        <\/div>\n\n\t\n\t\t\t\t\n\t    <\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\" \/>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-apply-now-for-the-2026-session\">Apply now for the 2026 session!<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><em>REGISTRATION FOR 2026 SESSION IS NOW CLOSED.<\/em><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Please be prepared to:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Upload resume\/CV.<\/li>\n\n\n\n<li>Include Statement of Purpose (500 words).<\/li>\n\n\n\n<li>State summer availability.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><em>Please note that all applicants need to be 18 years of age by June 1st, 2026.<\/em><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Following program acceptance, students will receive stipend and\/or housing agreements as applicable. All SUMMIT participants will be enrolled as a Boise State student (students from other institutions will be enrolled as non-degree seeking in order to earn the transferable academic credit).<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\" \/>\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--interstitial  site-panel-colorway-grey interstitial-panel__wrap--bottom top-padding--remove_padding bottom-padding--remove_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"interstitial\"\n         \n         data-modular-content>\n    \n\t    <div class=\"interstitial-panel__wrapper \">\n\n\t\n\t\n        \n        <div class=\"l-container interstitial-panel__content-wrapper interstitial-panel__content-block--bottom t-content \">\n                        <div class=\"l-content--inner\">\n                \n<div class=\"c-content-block interstitial-panel__content-block\">\n\n\t<div class=\"c-content-block__content interstitial-panel__content-inner\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title s-title h2\"\n\t\t>\n\n\tInterested in supporting SUMMIT?\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"interstitial-panel__description\" >\n\t<p>Email merc@boisestate.edu for more information!<\/p>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n            <\/div>\n        <\/div>\n\n\t\n\t\t\t\t\n\t    <\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n<div style=\"height:100px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>SUMMIT SUMMIT is an 8-week immersive summer program designed to give undergraduate students hands-on experience&#8230;<\/p>\n","protected":false},"author":3167,"featured_media":2953,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-templates\/page-department-landing.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-2941","page","type-page","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/2941","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/users\/3167"}],"replies":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/comments?post=2941"}],"version-history":[{"count":48,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/2941\/revisions"}],"predecessor-version":[{"id":3323,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/2941\/revisions\/3323"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media\/2953"}],"wp:attachment":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media?parent=2941"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}