{"id":3559,"date":"2026-09-17T11:16:57","date_gmt":"2026-09-17T17:16:57","guid":{"rendered":"https:\/\/www.boisestate.edu\/microelectronics\/?page_id=3559"},"modified":"2026-10-06T09:53:19","modified_gmt":"2026-10-06T15:53:19","slug":"bsmerf","status":"publish","type":"page","link":"https:\/\/www.boisestate.edu\/microelectronics\/bsmerf\/","title":{"rendered":"BSMERF"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\" id=\"h-do-you-have-an-interest-in-the-microelectronics-industry-and-the-research-that-pushes-it-forward\"><strong>Are you interested in microelectronics and the research shaping the future of the semiconductor industry? <\/strong>The Boise State Microelectronics Education and Research Fellowship (BSMERF) program offers Ph.D. students the opportunity to advance their research, tackle complex challenges, and contribute to the future of microelectronics.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--interstitial  site-panel-colorway-orange interstitial-panel__wrap--bottom top-padding--remove_padding bottom-padding--remove_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"interstitial\"\n         \n         data-modular-content>\n    \n\t    <div class=\"interstitial-panel__wrapper \">\n\n\t\n\t\n        \n        <div class=\"l-container interstitial-panel__content-wrapper interstitial-panel__content-block--bottom t-content \">\n                        <div class=\"l-content--inner\">\n                \n<div class=\"c-content-block interstitial-panel__content-block\">\n\n\t<div class=\"c-content-block__content interstitial-panel__content-inner\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title s-title h2\"\n\t\t>\n\n\tWhat is the BSMERF Program?\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"interstitial-panel__description\" >\n\t<p><\/p>\n<p class=\"wp-block-paragraph\">This award at Boise State University seeks to enhance research competitiveness and capacity through an investment in talent development. Fellow research topics will align with goals and programs supported by the NSF Directorate for Technology, Innovation, and Partnerships (TIP). As part of the Microelectronics Education and Research Center (MERC), the program integrates students into a robust ecosystem that spans six interdisciplinary Ph.D. programs. In addition to conducting fundamental research, Fellows are guided through a structured program involving mentorship, career readiness, and experiential learning designed to bridge the gap between academic research and the demands of the global semiconductor market.<\/p>\n<p><\/p>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n            <\/div>\n        <\/div>\n\n\t\n\t\t\t\t\n\t    <\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<h3 id=\"h-fellow-experience\" class=\"wp-block-heading\">Fellow <br>Experience<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Conduct <strong>fundamental microelectronics research<\/strong> within the interdisciplinary MERC ecosystem<\/li>\n\n\n\n<li>Collaborate across <strong>six Ph.D. programs<\/strong><\/li>\n\n\n\n<li>Receive <strong>faculty and industry mentorship<\/strong><\/li>\n\n\n\n<li>Participate in <strong>professional development and career readiness<\/strong><\/li>\n\n\n\n<li>Gain <strong>hands-on experience and connections with the semiconductor industry<\/strong><\/li>\n<\/ul>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<h3 id=\"h-fellowship-benefits\" class=\"wp-block-heading\">Fellowship Benefits<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>6 Ph.D. fellowships<\/strong> available<\/li>\n\n\n\n<li><strong>Up to 3 years of $37,000 annual salary<\/strong><\/li>\n\n\n\n<li><strong>Full tuition support<\/strong><\/li>\n\n\n\n<li>Research aligned with <strong>NSF TIP priorities<\/strong><\/li>\n\n\n\n<li>Investment in the next generation of <strong>microelectronics talent<\/strong><\/li>\n<\/ul>\n<\/div>\n<\/div>\n\n\n\n<p class=\"wp-block-paragraph\">In addition to world class research opportunities, students will participate in mentoring programs, professional development in concert with the semiconductor industry, and the <a href=\"https:\/\/www.boisestate.edu\/microelectronics\/tag\/upwards\/\" data-type=\"post_tag\" data-id=\"11\">UPWARDS for the Future<\/a> program.<\/p>\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--imagetext site-panel-colorway-grey top-padding--remove_padding bottom-padding--remove_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"imagetext\"\n  \t\t \n         data-modular-content>\n    \n\t<div class=\"panel-imagetext\">\n\t<div class=\"l-container--thin\">\n\t\t\n\t\n\t\n\t\t\t<div class=\"g-row g-row--no-gutters g-row--col-2--min-full \">\n\n\t\t\t\t<div class=\"g-col\">\n\t\t\t\t\t\n<div class=\"c-image site-panel__imgtxt-image\">\n\t\t<div  aria-label=\"Researchers working in the lab\" role=\"img\" data-expand=\"200\"   data-sizes=\"auto\" data-bgset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_558-Enhanced-NR-768x511.jpg 768w 511h, \nhttps:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_558-Enhanced-NR-1024x681.jpg 1024w 681h\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/themes\/core\/img\/theme\/shims\/large.png');\"  class=\"c-image__bg lazyload\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\n\t\t\t\t<div class=\"g-col\">\n\t\t\t\t\t<div class=\"site-panel__imgtxt-content\">\n\t\t\t\t\t\t\n<div class=\"c-content-block\">\n\n\t<div class=\"c-content-block__content\">\n\n\t\t\t\t\t\n<div\n\t\tclass=\"h2 site-panel__accent-title\"\n\t\t>\n\n\tBoise State University\n\n<\/div>\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title site-panel__imgtxt-panel-title s-title h2\"\n\t\t>\n\n\tEligible Ph.D. Programs\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"site-panel__imgtxt-panel-description t-content\" >\n\t<ul>\n<li><a href=\"https:\/\/www.boisestate.edu\/bme\/\">Biomedical Engineering<\/a><\/li>\n<li><a href=\"https:\/\/www.boisestate.edu\/biomolecularsciences\/prospective-students-apply-now\/biomolecular-ph-d\/\">Biomolecular Sciences<\/a><\/li>\n<li><a href=\"https:\/\/www.boisestate.edu\/computing\/academics\/doctoral-program\/\">Computing<\/a><\/li>\n<li><a href=\"https:\/\/www.boisestate.edu\/coen-ece\/programs\/grad-programs\/ece-phd\/\">Electrical and Computer Engineering<\/a><\/li>\n<li><a href=\"https:\/\/www.boisestate.edu\/engineeringphd\/\">Engineering<\/a><\/li>\n<li><a href=\"https:\/\/www.boisestate.edu\/coen-materials\/students\/graduate-studies\/phd-program\/\">Materials Science and Engineering<\/a><\/li>\n<\/ul>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\n\t\t\t<\/div>\n\n\t\t\n\t\t\t\t\n\t\t<\/div>\n<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 id=\"h-eligibility-requirements\" class=\"wp-block-heading\">Eligibility Requirements<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Eligibility:<\/strong> Must have the distinction of receiving an Honorable Mention from the NSF Graduate Research Fellowship Program (GRFP) no more than three years before accepting this Fellowship&nbsp;(e.g., For 2025 applicants must have been named a GRFP HM no earlier than Spring 2022). <\/li>\n\n\n\n<li><strong>Strong Candidates:<\/strong> Successful applicants will have research interests that align with faculty in the PhD program they are applying to. They will also have academic achievements, attributes, and experiences that demonstrate potential for significant research contributions, a passion and motivation for a STEM career, and evidence of leadership potential, initiative, and the ability to work well with others.<\/li>\n\n\n\n<li><strong>Boise State Graduate College Admission Requirements:<\/strong> At least a baccalaureate degree from a regionally accredited U.S. college or university, or a degree from a non-U.S. institution of higher education that is judged equivalent to a U.S. baccalaureate degree by the International Admissions Office.<\/li>\n<\/ul>\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--interstitial  site-panel-colorway-blue interstitial-panel__wrap--bottom top-padding--add_padding bottom-padding--add_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"interstitial\"\n         \n         data-modular-content>\n    \n\t    <div class=\"interstitial-panel__wrapper \">\n\n\t\n\t\n        \n        <div class=\"l-container interstitial-panel__content-wrapper interstitial-panel__content-block--bottom t-content \">\n                        <div class=\"l-content--inner\">\n                \n<div class=\"c-content-block interstitial-panel__content-block\">\n\n\t<div class=\"c-content-block__content interstitial-panel__content-inner\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title s-title h2\"\n\t\t>\n\n\tApply today!\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"interstitial-panel__description\" >\n\t<p><span style=\"font-weight: 400\">Qualified prospective students should apply through the NSF ETAP system <\/span><span style=\"font-weight: 400\">and contact faculty at Boise State University within their field of interest about possible research openings and opportunities.<\/span><\/p>\n<p><a class=\"c-btn c-btn--border\" href=\"https:\/\/etap.nsf.gov\/search?program=EGFP\">Apply here!<\/a><\/p>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n            <\/div>\n        <\/div>\n\n\t\n\t\t\t\t\n\t    <\/div>\n\n\t\t\t<\/div>\n\t\n","protected":false},"excerpt":{"rendered":"<p>Are you interested in microelectronics and the research shaping the future of the semiconductor industry?&#8230;<\/p>\n","protected":false},"author":3167,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-3559","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/3559","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/users\/3167"}],"replies":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/comments?post=3559"}],"version-history":[{"count":16,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/3559\/revisions"}],"predecessor-version":[{"id":3643,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/3559\/revisions\/3643"}],"wp:attachment":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media?parent=3559"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}