{"id":558,"date":"2024-07-31T12:00:37","date_gmt":"2024-07-31T18:00:37","guid":{"rendered":"https:\/\/www.boisestate.edu\/microelectronics\/?page_id=558"},"modified":"2026-08-27T10:45:06","modified_gmt":"2026-08-27T16:45:06","slug":"university-partnership-for-workforce-advancement-and-research-and-development-in-semiconductors","status":"publish","type":"page","link":"https:\/\/www.boisestate.edu\/microelectronics\/major-initiatives\/university-partnership-for-workforce-advancement-and-research-and-development-in-semiconductors\/","title":{"rendered":"UPWARDS for the Future"},"content":{"rendered":"\n\n\t<div class=\"panel s-wrapper site-panel site-panel--interstitial has_image site-panel-colorway-blue interstitial-panel__wrap--bottom top-padding--add_padding bottom-padding--add_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"interstitial\"\n         \n         data-modular-content>\n    \n\t    <div class=\"interstitial-panel__wrapper has_image\">\n\n\t\n\t\n                    <div class=\"interstitial-panel__img-wrapper l-container--thin\">\n                \n<div >\n\t\t<div  aria-label=\"UPWARDS reception dinner in Stueckle Sky Center\" role=\"img\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2026\/04\/Untitled-design-21-1600x826.png');\"  class=\"interstitial-panel__img\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n                <div class=\"interstitial-panel__img-caption-wrapper l-container--inner\">\n                    \n                <\/div>\n            <\/div>\n        \n        <div class=\"l-container interstitial-panel__content-wrapper interstitial-panel__content-block--bottom t-content \">\n                            <div class=\"interstitial-panel__img-caption-wrapper l-container--inner\">\n                    \n                <\/div>\n                        <div class=\"l-content--inner\">\n                \n<div class=\"c-content-block interstitial-panel__content-block\">\n\n\t<div class=\"c-content-block__content interstitial-panel__content-inner\">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title s-title h2\"\n\t\t>\n\n\tAbout\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"interstitial-panel__description\" >\n\t<p>UPWARDS for the Future is a unique partnership with Boise State and 10 other universities across the globe to build a diverse semiconductor workforce, advance research, and expand opportunities for women through collaboration and experiential learning.<\/p>\n<p><a class=\"c-btn\" href=\"http:\/\/www.upwardsforthefuture.com\">Visit the UPWARDS Website here<\/a><\/p>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n            <\/div>\n        <\/div>\n\n\t\n\t\t\t\t\n\t    <\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t\t\t<div class=\"panel s-wrapper site-panel site-panel--wysiwyg top-padding--remove_padding bottom-padding--add_padding\"\n\t\t\t\t data-index=\"\"\n\t\t\t\t data-js=\"panel\"\n\t\t\t\t data-type=\"wysiwyg\"\n\t\t\t     \n\t\t\t\t data-modular-content>\n\t\n\t<div class=\"panel-wysiwyg--3col option_stacked top-padding--remove_padding bottom-padding--add_padding\">\n    \n\t\t\t\t\t\t<div class=\"l-content--outer\">\n\t\t\t\t<header class=\"s-header l-content--inner\">\n\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title h2\"\n\t\t>\n\n\tDetails\n\n<\/h2>\n\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t<\/header>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t<div class=\"l-container--thin\">\n\t\t\t<div class=\"s-content l-container--inner--no-padding\">\n\t\t\t\t<div class=\"g-row g-row--panel-3col\"\n\t\t\t\t\tdata-depth=\"0\"\n\t\t\t\t\tdata-name=\"columns\"\n\t\t\t\t\tdata-livetext>\n\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"g-col t-content g-col--border\"\n\t\t\t\t\t\t\tdata-depth=\"1\"\n\t\t\t\t\t\t\tdata-index=\"0\"\n\t\t\t\t\t\t\tdata-name=\"column_content\"\n\t\t\t\t\t\t\tdata-autop=\"true\"\n\t\t\t\t\t\t\tdata-livetext=\"true\">\n\t\t\t\t\t\t\t<h3>What<\/h3>\n<p>Boise State is one of 11 institutes of higher education pioneering the University Partnership for Workforce Advancement and Research and Development in Semiconductors <a href=\"https:\/\/www.upwardsforthefuture.com\/\">(UPWARDS)<\/a> for the Future program.<\/p>\n<p>UPWARDS for the Future is an international semiconductor program that is funded by Micron, Tokyo Electron and the National Science Foundation.<\/p>\n<p>This partnership was launched in 2023 by Micron Technology, Inc.<\/p>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"g-col t-content g-col--border\"\n\t\t\t\t\t\t\tdata-depth=\"1\"\n\t\t\t\t\t\t\tdata-index=\"1\"\n\t\t\t\t\t\t\tdata-name=\"column_content\"\n\t\t\t\t\t\t\tdata-autop=\"true\"\n\t\t\t\t\t\t\tdata-livetext=\"true\">\n\t\t\t\t\t\t\t<h3>Who<\/h3>\n<p><strong>Japanese Universities:<\/strong><\/p>\n<ul>\n<li><a href=\"https:\/\/www.hiroshima-u.ac.jp\/en\">Hiroshima<\/a>\u00a0<a href=\"https:\/\/www.hiroshima-u.ac.jp\/en\">University<\/a><\/li>\n<li><a href=\"https:\/\/www.kyushu-u.ac.jp\/en\/\">Kyushu<\/a>\u00a0<a href=\"https:\/\/www.kyushu-u.ac.jp\/en\/\">University<\/a><\/li>\n<li><a href=\"https:\/\/en.nagoya-u.ac.jp\/\">Nagoya University<\/a><\/li>\n<li><a href=\"https:\/\/www.tohoku.ac.jp\/en\/\">Tohoku University<\/a><\/li>\n<li><a href=\"https:\/\/www.titech.ac.jp\/english\">Institute of Science Tokyo<\/a><\/li>\n<\/ul>\n<p><strong>USA Universities:<\/strong><\/p>\n<ul>\n<li><a href=\"https:\/\/www.boisestate.edu\/\">Boise State University<\/a><\/li>\n<li><a href=\"https:\/\/www.rpi.edu\/\">Rensselaer Polytechnic Institute<\/a><\/li>\n<li><a href=\"https:\/\/www.rit.edu\/\">Rochester Institute of Technology<\/a><\/li>\n<li><a href=\"https:\/\/www.washington.edu\/\">University of Washington<\/a><\/li>\n<li><a href=\"https:\/\/www.vt.edu\/\">Virginia Tech<\/a><\/li>\n<li><a href=\"https:\/\/www.purdue.edu\/\">Purdue University<\/a><\/li>\n<\/ul>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"g-col t-content g-col--border\"\n\t\t\t\t\t\t\tdata-depth=\"1\"\n\t\t\t\t\t\t\tdata-index=\"2\"\n\t\t\t\t\t\t\tdata-name=\"column_content\"\n\t\t\t\t\t\t\tdata-autop=\"true\"\n\t\t\t\t\t\t\tdata-livetext=\"true\">\n\t\t\t\t\t\t\t<h3>Objectives<\/h3>\n<p>The UPWARDS program seeks to empower collaboration between industry and higher education across Japan and the U.S., and together:<\/p>\n<ul>\n<li>Advance women in semiconductors<\/li>\n<li>Create industry relevant <a href=\"https:\/\/www.boisestate.edu\/microelectronics\/advancing-your-knowledge\/\">curriculum design<\/a> and subsequent implementation<\/li>\n<li>Promote experiential learning<\/li>\n<li>Encourage student and faculty exchanges<\/li>\n<li>Conduct semiconductor and memory centric research (non-IP).<\/li>\n<\/ul>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\n\t\t\t\t<\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n    \n\t\t\t\t\n\t<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\" \/>\n\n\n\n<h2 id=\"h-upwards-pillars\" class=\"wp-block-heading\">UPWARDS Pillars<\/h2>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\"><summary>1. Curriculum Design and Implementation<\/summary>\n<p class=\"wp-block-paragraph\"><strong>Overarching Mission\/Vision: <\/strong>To create an efficient, inclusive framework for sharing industry-aligned curriculum that supports student exchange and experiential learning for all types of learners, while establishing ongoing processes to ensure continuous improvement and content relevance.<\/p>\n<\/details>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\"><summary>2. Women in Semiconductors<\/summary>\n<p class=\"wp-block-paragraph\"><strong>Overarching Mission\/Vision<\/strong>:&nbsp; Offer programming that prepares students for semiconductor careers with an emphasis on increasing the percentage of women in the field<\/p>\n<\/details>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\"><summary>3. Experiential Learning<\/summary>\n<p class=\"wp-block-paragraph\"><strong>Overarching Mission\/Vision: <\/strong>Broaden and deepen education by real experience. Broaden the scope of people interested in semiconductors (K-12, educators, veterans\/career change), and deepen understanding of semiconductors (undergrad\/grad students, engineers within the industry)<\/p>\n<\/details>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\"><summary>4. Semiconductor and Memory Centric Research<\/summary>\n<p class=\"wp-block-paragraph\"><strong>Overarching Mission\/Vision: <\/strong>Create a vibrant and sustainable microelectronics research community, comprising a diverse set of academic and industrial researchers from Japan and USA.<\/p>\n<\/details>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\"><summary>5. Student and Faculty Exchanges<\/summary>\n<p class=\"wp-block-paragraph\"><strong>Overarching Mission\/Vision: <\/strong>To establish and regularly share common goals for student, faculty, and staff exchanges, track and communicate progress and outcomes, and provide the infrastructure needed to facilitate study-abroad opportunities.<\/p>\n<\/details>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\" \/>\n\n\n\n\n\t\t\t<div class=\"panel s-wrapper site-panel site-panel--news_feed top-padding--remove_padding bottom-padding--add_padding\"\n\t\t\t\t data-index=\"\"\n\t\t\t\t data-js=\"panel\"\n\t\t\t\t data-type=\"news_feed\"\n\t\t\t     \n\t\t\t\t data-modular-content>\n\t\n\t<div class=\"l-container l-container--thin\">\n\t\n\t\n\t\t\t\t\t<header class=\"s-header s-header--panel \">\n\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title site-panel__title--orange h2\"\n\t\t>\n\n\tUPWARDS Updates\n\n<\/h2>\n\t\t\t\t\n\t\t\t\t<div class=\"site-panel__description site-panel__description--desktop s-desc t-content\">\n\t\t\t\t\t<div>\n\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t<\/header>\n\t\t\n\t\n\t\t\t\t\t<div class=\"g-row g-row--col-2--min-full\">\n\n\t\t\t\t\t\t\t\t<div class=\"news-panel__featured g-col\">\n<div class=\"c-card c-card--img\">\n\n\t\t\t<a href=\"https:\/\/www.boisestate.edu\/microelectronics\/2025\/11\/01\/boise-state-students-travel-the-world-to-gain-hands-on-experience-in-semiconductors\/\" class=\"c-card__link-wrap\"><span class=\"u-screen-reader-text\">Boise State Students Travel the World to Gain Hands-on Experience in Semiconductors.<\/span><\/a>\n\t\n\t<span aria-hidden=\"true\">\n\t\t\t\t\t<div class=\"news-panel__image-contain\">\n<div >\n\t\t<div style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2026\/04\/image-2-1024x768.jpeg');\"  class=\"tribe-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\t\t\t<\/span>\n\n    \n\t<div class=\"c-card__content\" aria-hidden=\"true\">\n\n                    <div class=\"c-card__content-inner\">\n        \n                            <div class=\"c-card__meta\"><div class=\"\">November 01, 2025<\/div><\/div>\n            \n                            \n<h3\n\t\tclass=\"c-card__title\"\n\t\t>\n\n\tBoise State Students Travel the World to Gain Hands-on Experience in Semiconductors.\n\n<\/h3>\n            \n                            <div class=\"c-card__descrip\">A key part of Boise State\u2019s focus and the mission of the Microelectronics Education and&#8230;<\/div>\n            \n            \n            \n                    <\/div>\n        \n\t<\/div>\n\n\t\n<\/div>\n<\/div>\n\t\t\t\t\t\t\t\t<div class=\"news-panel__additional g-col\"><div class=\"g-row g-row--col-2--min-full\"><div class=\"g-col\">\n<div class=\"c-card c-card--img\">\n\n\t\t\t<a href=\"https:\/\/www.boisestate.edu\/microelectronics\/2025\/10\/25\/boise-state-senior-bridges-cultures-circuits-with-japans-kyushu-university\/\" class=\"c-card__link-wrap\"><span class=\"u-screen-reader-text\">Boise State senior bridges cultures, circuits with Japan\u2019s Kyushu University<\/span><\/a>\n\t\n\t<span aria-hidden=\"true\">\n\t\t\t\t\t<div class=\"news-panel__image-contain\">\n<div >\n\t\t<div style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/10\/IMG-20250729-WA0025-1-1024x768.jpg');\"  class=\"tribe-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\t\t\t<\/span>\n\n    \n\t<div class=\"c-card__content\" aria-hidden=\"true\">\n\n                    <div class=\"c-card__content-inner\">\n        \n                            <div class=\"c-card__meta\"><div class=\"\">October 25, 2025<\/div><\/div>\n            \n                            \n<h3\n\t\tclass=\"c-card__title\"\n\t\t>\n\n\tBoise State senior bridges cultures, circuits with Japan\u2019s Kyushu University\n\n<\/h3>\n            \n            \n            \n            \n                    <\/div>\n        \n\t<\/div>\n\n\t\n<\/div>\n<\/div>\n\t\t\t\t\t\t\t\t<div class=\"g-col\">\n<div class=\"c-card c-card--img\">\n\n\t\t\t<a href=\"https:\/\/www.boisestate.edu\/microelectronics\/2025\/10\/24\/engineering-students-find-global-microelectronics-learning-connection-at-nagoya-university\/\" class=\"c-card__link-wrap\"><span class=\"u-screen-reader-text\">Engineering students find global microelectronics learning, connection at Nagoya University<\/span><\/a>\n\t\n\t<span aria-hidden=\"true\">\n\t\t\t\t\t<div class=\"news-panel__image-contain\">\n<div >\n\t\t<div style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2026\/04\/image-768x1024.jpeg');\"  class=\"tribe-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\t\t\t<\/span>\n\n    \n\t<div class=\"c-card__content\" aria-hidden=\"true\">\n\n                    <div class=\"c-card__content-inner\">\n        \n                            <div class=\"c-card__meta\"><div class=\"\">October 24, 2025<\/div><\/div>\n            \n                            \n<h3\n\t\tclass=\"c-card__title\"\n\t\t>\n\n\tEngineering students find global microelectronics learning, connection at Nagoya University\n\n<\/h3>\n            \n            \n            \n            \n                    <\/div>\n        \n\t<\/div>\n\n\t\n<\/div>\n<\/div>\n\t\t\t\t\t\t\t\t<div class=\"g-col\">\n<div class=\"c-card c-card--img\">\n\n\t\t\t<a href=\"https:\/\/www.boisestate.edu\/microelectronics\/2024\/11\/27\/from-boise-to-hiroshima-bridging-borders-in-semiconductor-innovation\/\" class=\"c-card__link-wrap\"><span class=\"u-screen-reader-text\">From Boise to Hiroshima: bridging borders in semiconductor innovation<\/span><\/a>\n\t\n\t<span aria-hidden=\"true\">\n\t\t\t\t\t<div class=\"news-panel__image-contain\">\n<div >\n\t\t<div style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/11\/IMG_0233-1024x768.jpeg');\"  class=\"tribe-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\t\t\t<\/span>\n\n    \n\t<div class=\"c-card__content\" aria-hidden=\"true\">\n\n                    <div class=\"c-card__content-inner\">\n        \n                            <div class=\"c-card__meta\"><div class=\"\">November 27, 2024<\/div><\/div>\n            \n                            \n<h3\n\t\tclass=\"c-card__title\"\n\t\t>\n\n\tFrom Boise to Hiroshima: bridging borders in semiconductor innovation\n\n<\/h3>\n            \n            \n            \n            \n                    <\/div>\n        \n\t<\/div>\n\n\t\n<\/div>\n<\/div>\n\t\t\t\t\t\t\t\t<div class=\"g-col\">\n<div class=\"c-card c-card--img\">\n\n\t\t\t<a href=\"https:\/\/www.boisestate.edu\/microelectronics\/2024\/10\/22\/upwards-program-brings-boise-state-students-to-japan\/\" class=\"c-card__link-wrap\"><span class=\"u-screen-reader-text\">UPWARDS Program brings Boise State students to Japan<\/span><\/a>\n\t\n\t<span aria-hidden=\"true\">\n\t\t\t\t\t<div class=\"news-panel__image-contain\">\n<div >\n\t\t<div style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/10\/Screenshot-2024-10-24-150948.png');\"  class=\"tribe-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\t\t\t<\/span>\n\n    \n\t<div class=\"c-card__content\" aria-hidden=\"true\">\n\n                    <div class=\"c-card__content-inner\">\n        \n                            <div class=\"c-card__meta\"><div class=\"\">October 22, 2024<\/div><\/div>\n            \n                            \n<h3\n\t\tclass=\"c-card__title\"\n\t\t>\n\n\tUPWARDS Program brings Boise State students to Japan\n\n<\/h3>\n            \n            \n            \n            \n                    <\/div>\n        \n\t<\/div>\n\n\t\n<\/div>\n<\/div><\/div><\/div>\n\t\t\t\n\t\t\t<div class=\"site-panel__description--mobile t-content\">\n\t\t\t\t\n\t\t\t<\/div>\n\n\t\t<\/div>\n\t\n\t\n\t\t\t\t\n\t\t<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--modal top-padding--add_padding bottom-padding--remove_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"modal\"\n\t\t \n\n         data-modular-content>\n    \n\t\t\t<div class=\"site-panel__gallery-modal-wrapper\" data-js=\"gallery-modal-panel\">\n\t\t<div class=\"l-container site-panel__gallery-modal-inner\">\n\t\t\t<div class=\"l-container l-container--boxed-background\">\n\t\t\t\t<div class=\"site-panel--boxed-background\"><\/div>\n\t\t\t<\/div>\n\t\t\t<div class=\"l-container--inner\">\n\n\t\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"s-content site-panel__gallery-modal-content\">\n\t\t\t\t\t\t\t<div class=\"s-content site-panel__gallery-modal-preview\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n<div class=\"site-panel__gallery-modal-preview-image\">\n\t\t<div  aria-label=\"students on blue turf\" role=\"img\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/UPWARDS-on-the-blue-1024x681.png');\"  class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n<div class=\"site-panel__gallery-modal-preview-image\">\n\t\t<div  aria-label=\"\" role=\"img\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_099-1024x682.jpg');\"  class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n<div class=\"site-panel__gallery-modal-preview-image\">\n\t\t<div  aria-label=\"\" role=\"img\" style=\"background-image:url('https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_558-Enhanced-NR-1024x681.jpg');\"  class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<header class=\"s-header site-panel__gallery-modal-header\">\n\n\t\t                <span class=\"site-panel__accent-title\">\n\t\t                    \n\t\t                <\/span>\n\n\t\t\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title h2 site-panel__gallery-modal-title\"\n\t\t>\n\n\tUPWARDS at Boise State Photo Gallery\n\n<\/h2>\n\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\n<button class=\" c-btn c-btn-sm site-panel__gallery-trigger\"\n\t\ttype=\"button\"\n\t\t\t\ttype='button' aria-label='View Gallery' data-js='gallery-modal-trigger'>\n\t\t\t<span class=\"c-btn__text\">View Gallery<\/span>\n\t<\/button>\n\n\n\t\t\t\t\t\t<\/header>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<script data-js=\"\" type=\"text\/template\" data-script=\"gallery-dialog-script\">\n\t\t\t\t\t\t<div class=\"site-panel__gallery-modal-gallery\" data-js=\"gallery-modal\">\n\t\t\t\t\t\t\t\n<span\n\t\tclass=\"gallery-modal__dialog-title\"\n\t\t>\n\n\tUPWARDS at Boise State Photo Gallery\n\n<\/span>\n\t\t\t\t\t\t\t<div class=\"l-container--inner--no-padding\">\n\t\t\t\t\t\t\t\t\n<div class=\"c-slider site-panel__gallery-modal-slider\">\n\t<div class=\"c-slider__main swiper-container c-slider__main--has-arrows\" data-js='c-slider'>\n\t\t<div class=\"c-slider__wrapper swiper-wrapper\">\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"students on blue turf\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/UPWARDS-on-the-blue-1024x681.png\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/UPWARDS-on-the-blue.png 1188w 790h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">1\/16 <\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_099-1024x682.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_099-scaled.jpg 2560w 1706h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">2\/16: UPWARDS for the Future Network (a collaborative initiative between Micron, Tokyo Electron, and 11 leading universities across the U.S. and Japan seeking to cultivate a more diverse, robust and highly skilled talent pipeline for the semiconductor workforce), reception dinner with speakers (Dan Lamborn, Lauren McLean, Dr. Nancy Glenn, Fran Dillard, Alex Oscilowski, Ken Todoriki), group photo on the Blue, photo by Priscilla Grover<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_558-Enhanced-NR-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_558-Enhanced-NR-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">3\/16: UPWARDS for the Future, MER, April 14-17, 2025, Photo by Sean Evans<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_061-1024x682.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_061-scaled.jpg 2560w 1706h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">4\/16: UPWARDS for the Future Network (a collaborative initiative between Micron, Tokyo Electron, and 11 leading universities across the U.S. and Japan seeking to cultivate a more diverse, robust and highly skilled talent pipeline for the semiconductor workforce), reception dinner with speakers (Dan Lamborn, Lauren McLean, Dr. Nancy Glenn, Fran Dillard, Alex Oscilowski, Ken Todoriki), group photo on the Blue, photo by Priscilla Grover<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_020_179-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_020_179-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">5\/16: UPWARDS 4th US-Japan Workshop, Microelectronics, MER Institute, April 14, 2025, Photo by Luan Teed<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_020_068-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_020_068-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">6\/16: UPWARDS 4th US-Japan Workshop, Microelectronics, MER Institute, April 14, 2025, Photo by Luan Teed<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_109-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_109-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">7\/16: UPWARDS for the Future Network (a collaborative initiative between Micron, Tokyo Electron, and 11 leading universities across the U.S. and Japan seeking to cultivate a more diverse, robust and highly skilled talent pipeline for the semiconductor workforce), reception dinner with speakers (Dan Lamborn, Lauren McLean, Dr. Nancy Glenn, Fran Dillard, Alex Oscilowski, Ken Todoriki), group photo on the Blue, photo by Priscilla Grover<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_263-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_263-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">8\/16: UPWARDS for the Future, MER, April 14-17, 2025, Photo by Sean Evans<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_138-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_138-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">9\/16: UPWARDS for the Future Network (a collaborative initiative between Micron, Tokyo Electron, and 11 leading universities across the U.S. and Japan seeking to cultivate a more diverse, robust and highly skilled talent pipeline for the semiconductor workforce), reception dinner with speakers (Dan Lamborn, Lauren McLean, Dr. Nancy Glenn, Fran Dillard, Alex Oscilowski, Ken Todoriki), group photo on the Blue, photo by Priscilla Grover<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_020_112-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_020_112-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">10\/16: UPWARDS 4th US-Japan Workshop, Microelectronics, MER Institute, April 14, 2025, Photo by Luan Teed<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_042-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_042-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">11\/16: UPWARDS for the Future, MER, April 14-17, 2025, Photo by Sean Evans<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_813-Enhanced-NR-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_813-Enhanced-NR-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">12\/16: UPWARDS for the Future, MER, April 14-17, 2025, Photo by Sean Evans<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_327-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_327-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">13\/16: UPWARDS for the Future, MER, April 14-17, 2025, Photo by Sean Evans<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_094-1024x682.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_094-scaled.jpg 2560w 1706h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">14\/16: UPWARDS for the Future Network (a collaborative initiative between Micron, Tokyo Electron, and 11 leading universities across the U.S. and Japan seeking to cultivate a more diverse, robust and highly skilled talent pipeline for the semiconductor workforce), reception dinner with speakers (Dan Lamborn, Lauren McLean, Dr. Nancy Glenn, Fran Dillard, Alex Oscilowski, Ken Todoriki), group photo on the Blue, photo by Priscilla Grover<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_081-1024x681.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_021_081-scaled.jpg 2560w 1703h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">15\/16: UPWARDS for the Future, MER, April 14-17, 2025, Photo by Sean Evans<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"c-slider__slide swiper-slide\">\n\t\t\t\t\t\n<div >\n\t\t<figure   class=\"site-panel__gallery-modal-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_133-1024x683.jpg\" sizes=\"(min-width: 1260px) 1260px, 100vw\" srcset=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/04\/D_2504_023_133-scaled.jpg 2560w 1707h\" \/>\n\t\t\n\t\t\n\t\t<span class=\"c-slider__slide-caption\" aria-label=\"Image Caption\">16\/16: UPWARDS for the Future Network (a collaborative initiative between Micron, Tokyo Electron, and 11 leading universities across the U.S. and Japan seeking to cultivate a more diverse, robust and highly skilled talent pipeline for the semiconductor workforce), reception dinner with speakers (Dan Lamborn, Lauren McLean, Dr. Nancy Glenn, Fran Dillard, Alex Oscilowski, Ken Todoriki), group photo on the Blue, photo by Priscilla Grover<\/span>\n\n\t\t<\/figure>\n\t<\/div>\n\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\n\t\t\t\t\t<div class=\"c-slider__arrows\">\n\t\t\t\t<div class=\"c-slider__button c-slider__button--prev swiper-button-prev\"><\/div>\n\t\t\t\t<div class=\"c-slider__button c-slider__button--next swiper-button-next\"><\/div>\n\t\t\t<\/div>\n\t\t\t<\/div>\n\t \n<\/div>\n\n\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/script>\n\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t<\/div>\n\t\t<\/div>\n\t<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t<div class=\"panel s-wrapper site-panel site-panel--videotext site-panel-colorway-blue top-padding--add_padding bottom-padding--add_padding\"\n         data-index=\"\"\n         data-js=\"panel\"\n         data-type=\"videotext\"\n         \n         data-modular-content>\n    \n\t<div class=\"site-panel__video-text-layout \">\n    \n\t\n\t        <div class=\"l-content--outer\">\n            <div class=\"site-panel__video-text-content-wrapper l-content--inner\">\n                \n<div class=\"site-panel__accent-title site-panel__video-text-accent-title\" >\n\tAll that is happening here on campus!\n<\/div>\n\n                <div class=\"site-panel__video-text-content\">\n                    \n<div class=\"c-content-block \">\n\n\t<div class=\"c-content-block__content \">\n\n\t\t\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title site-panel__title site-panel__title-has-colorway h2\"\n\t\t>\n\n\tSemiconductor Research at Boise State\n\n<\/h2>\n\t\t\n\t\t\t\t\t\n<div class=\"site-panel__video-text-description t-content\" >\n\t<p>Closed captions are provided and a text transcript is provided on this page following the video.<\/p>\n\n<\/div>\n\n\t\t\n\t\t\n\t<\/div>\n<\/div>\n\n                <\/div>\n            <\/div>\n\n\n            <div class=\"site-panel__video-text-actions l-content--inner\">\n                <div class=\"site-panel__video-text-cta\">\n                    \n                <\/div>\n                \n<div\n    class=\"c-video c-video--lazy\"\n    data-js='c-video' data-embed-id='LXW_i3h51Eg' data-embed-provider='YouTube'\n    data-id=\"\"\n>\n    <div class=\"c-video__wrapper\">\n        <figure class=\"c-video__embed\">\n            <a\n                href=\"https:\/\/youtu.be\/LXW_i3h51Eg?si=3X86k2SlzRJK59c9\"\n                class=\"c-video__trigger\"\n                data-js=\"c-video-trigger\"\n                title=\"Play Video\"\n                target=\"_blank\"\n                rel=\"noopener\"\n            >\n                <img decoding=\"async\"\n                    class=\"c-video__image lazyload\"\n                    src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/themes\/core\/img\/theme\/shims\/16x9.png\"\n                    data-src=\"https:\/\/i.ytimg.com\/vi\/LXW_i3h51Eg\/maxresdefault.jpg\"\n\t\t\t\t\talt=\"Video Placeholder Image\"\n                    role=\"presentation\"\n                \/>\n                <figcaption class=\"c-video__caption\">\n                    <i class=\"c-video__icon icon icon-play\"><\/i>\n                    <span class=\"c-video__trigger-label\">Play Semiconductors at Boise State<\/span>\n                <\/figcaption>\n            <\/a>\n        <\/figure>\n    <\/div>\n<\/div>\n\n            <\/div>\n        <\/div>\n\n    \n\t\t\t\t\n\t<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n\n\t\t\t<div class=\"panel s-wrapper site-panel site-panel--wysiwyg top-padding--add_padding bottom-padding--add_padding\"\n\t\t\t\t data-index=\"\"\n\t\t\t\t data-js=\"panel\"\n\t\t\t\t data-type=\"wysiwyg\"\n\t\t\t     \n\t\t\t\t data-modular-content>\n\t\n\t<div class=\"panel-wysiwyg--1col option_stacked top-padding--add_padding bottom-padding--add_padding\">\n    \n\t\t\t\t\t\t<div class=\"l-content--outer\">\n\t\t\t\t<header class=\"s-header l-content--inner\">\n\n\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title h2\"\n\t\t>\n\n\tVideo Transcript\n\n<\/h2>\n\n\t\t\t\t\t\t\t\t\t\t\t\n<div class=\"site-panel__description s-desc t-content\" >\n\t<p>[Upbeat music]<\/p>\n<p>Kurtis: One of the top exports of Idaho is semiconductors. And so, you know, obviously, the local and regional economy is incredibly dependent on microelectronics and semiconductors. Our work here at Boise State, not just mine, but many of the faculty who are in this area is incredibly impactful. I think locally and regionally, we have students not just at the bachelor&#8217;s level, but also the Ph.D. level who go to work for all these different companies in the region. And obviously with new announcements of new facilities and new fabs being built, that&#8217;s going to be &#8211; have a huge impact in the future.<\/p>\n<p>So the CHIPS Act is legislation that was passed last year by the federal government to incentivize semiconductors and microelectronics manufacturing in the United States. There was also part of that, the Chips and Science Act, and so there&#8217;s a large amount of money that was also dedicated just to general science and engineering research and development funds. But the CHIPS Act specifically was something over $50 billion, I think, that is going toward many different aspects of microelectronics manufacturing in the United States.<\/p>\n<p>This legislation matters a lot to Boise State and a lot of other universities because a large part of it actually is workforce development and education focused. In other words, you know, if you&#8217;re going to build a manufacturing fab that&#8217;s producing semiconductors and chips, you need to have the workforce that&#8217;s competent to do that. Especially if it&#8217;s, you know, very advanced technology, much of which has been produced recently more in Taiwan and China than in the United States. So bringing that advanced technology manufacturing back to the United States and having the workforce to support that is is especially important.<\/p>\n<p>Here at Boise State, you know, we have clean room here, the Idaho Micro Fabrication Lab, and lots of other research programs that are focused on semiconductors and microelectronics. So we&#8217;re kind of at the ready to support different companies with their workforce development efforts. My research group focuses on what we call neuromorphic computing, which is basically building electronic circuits that learn and process information like the brain. There are a lot of different groups here doing research in new types of semiconductor materials, new types of devices, and also the integrated circuits to build different types of chips. And the CHIPS Act is really beneficial for all of us, you know, not just from the workforce development standpoint, but also from providing research funding standpoint.<\/p>\n<p>Workforce development is critical for all the companies who are doing semiconductor manufacturing, but that workforce includes Ph.D. level folks who are developing the next generation of electronics and electronic circuits. What drives and inspires me is just working with students. I think that&#8217;s the reason most of us become faculty. Obviously we&#8217;re interested in doing our research and trying to push the envelope, so to speak, right, in terms of what&#8217;s possible with technology. But really the day to day is working with students, teaching students and getting them excited about the same kinds of things that you&#8217;re excited about, and that is just new discoveries, especially as they relate to semiconductors and microelectronics.<\/p>\n<p>[Upbeat music]<\/p>\n\n<\/div>\n\n\t\t\t\t\t\n\t\t\t\t<\/header>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t<div class=\"l-container--thin\">\n\t\t\t<div class=\"s-content l-container--inner--no-padding\">\n\t\t\t\t<div class=\"g-row g-row--panel-1col\"\n\t\t\t\t\tdata-depth=\"0\"\n\t\t\t\t\tdata-name=\"columns\"\n\t\t\t\t\tdata-livetext>\n\n\t\t\t\t\t\t\t\t\t\t\t<div class=\"g-col t-content\"\n\t\t\t\t\t\t\tdata-depth=\"1\"\n\t\t\t\t\t\t\tdata-index=\"0\"\n\t\t\t\t\t\t\tdata-name=\"column_content\"\n\t\t\t\t\t\t\tdata-autop=\"true\"\n\t\t\t\t\t\t\tdata-livetext=\"true\">\n\t\t\t\t\t\t\t\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\n\t\t\t\t<\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n    \n\t\t\t\t\n\t<\/div>\n\n\t\t\t<\/div>\n\t\n","protected":false},"excerpt":{"rendered":"<p>UPWARDS Pillars<\/p>\n","protected":false},"author":2793,"featured_media":1568,"parent":2633,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-templates\/page-department-landing.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-558","page","type-page","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/558","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/users\/2793"}],"replies":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/comments?post=558"}],"version-history":[{"count":132,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/558\/revisions"}],"predecessor-version":[{"id":3533,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/558\/revisions\/3533"}],"up":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/2633"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media\/1568"}],"wp:attachment":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media?parent=558"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}