{"id":64,"date":"2023-03-17T13:39:33","date_gmt":"2023-03-17T19:39:33","guid":{"rendered":"https:\/\/www.boisestate.edu\/microelectronics\/?page_id=64"},"modified":"2025-11-03T14:58:33","modified_gmt":"2025-11-03T21:58:33","slug":"industry-advisory-board","status":"publish","type":"page","link":"https:\/\/www.boisestate.edu\/microelectronics\/about-microelectronics-education-and-research\/industry-advisory-board\/","title":{"rendered":"Industry Advisory Board"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\">The Industry Advisory Board for MERC helps connect the Center and Boise State to the microelectronic and semiconductor industry.&nbsp; These members will support the Center by determining education and workforce needs that MERC continually works on.&nbsp; They will also help MERC and the university navigate funding opportunities, including collaborations with others in the industry and the government.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The members of the board are central in MERC&#8217;s <a href=\"https:\/\/www.boisestate.edu\/microelectronics\/about-microelectronics-education-and-research\/\">vision and mission.<\/a><\/p>\n\n\n\n\n\t\t\t<div class=\"panel s-wrapper site-panel site-panel--people-list top-padding--add_padding bottom-padding--add_padding\"\n\t\t\t\t data-index=\"\"\n\t\t\t\t data-js=\"panel\"\n\t\t\t\t data-type=\"people-list\"\n\t\t\t     \n\t\t\t\t data-modular-content>\n\t\n\t<div class=\"site-panel__people-list panel-people l-content--outer top-padding--add_padding bottom-padding--add_padding\">\n\t<div class=\"l-content--inner\">\n\t\t\n\t\n\t\t\t\t<div class=\"oneUp\">\n\t\t\t\t<header class=\"s-header t-content\">\n\t\t\t\t\t<div>\n\t\t\t\t\t\t\n<h2\n\t\tclass=\"site-panel__title s-title h2\"\n\t\t>\n\n\tAdvisory Board\n\n<\/h2>\n\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<div>\n\t\t\t\t\t\t<form class=\"people-list__search\" role=\"search\" aria-label=\"Filter List Form\">\n\t\t\t\t\t\t\t<label for=\"people-list-search-input-6a951962b437f\" class=\"u-visual-hide\">Search<\/label>\n\t\t\t\t\t\t\t<input class=\"people-list__search-input\" type=\"text\" name=\"src\" placeholder=\"Search for people\" aria-label=\"Advisory Board Text input\" id=\"people-list-search-input-6a951962b437f\">\n\t\t\t\t\t\t\t<button class=\"people-list__search-submit\" type=\"submit\" name=\"people-list__search-submit\" aria-label=\"Search people\">\n\t\t\t\t\t\t\t\t<i class=\"icon icon-search-thick\"><\/i>\n\t\t\t\t\t\t\t<\/button>\n\t\t\t\t\t\t<\/form>\n\t\t\t\t\t\t<div class=\"people-list__search-status u-visual-hide\" role=\"status\" aria-live=\"polite\" aria-atomic=\"true\"><\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/header>\n\t\t\t<\/div>\n\t\t\t<div class=\"s-content\">\n\t\t\t\t<ul class=\"panel-people__listing oneUp\">\n\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Headshot of Jinju Beineke\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/DSC_6587-1-1152x1725.jpg\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tJinju Beineke\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Jinju Beineke is currently senior director of technology at Photronics, a global semiconductor company specializing in Photomask Manufacturing. Photronics is the only US based photomask company in the world.\u00a0 It is located in Boise, Idaho.<\/p>\n<p>Jinju has over 17 years of experience in Photomask manufacturing, equipment, and R&amp;D, with emphasis in new process development. She has co-authored multiple papers in advanced Photomask process development, including EUV technology. Jinju Beineke is currently a PhD candidate at Boise State University.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Jinju Beineke is currently senior director of technology at Photronics, a global semiconductor company specializing in Photomask Manufacturing. Photronics is the only US based photomask company in the world.\u00a0 It is located in Boise, Idaho.<\/p>\n<p>Jinju has over 17 years of experience in Photomask manufacturing, equipment, and R&amp;D, with emphasis in new process development. She has co-authored multiple papers in advanced Photomask process development, including EUV technology. Jinju Beineke is currently a PhD candidate at Boise State University.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Becky Cook\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/02\/IMG_0937-e1739307112763.jpg\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tBecky Cook\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Becky Cook is a Boise native. She attended the College of Idaho where she received her undergraduate degree. Afterward, she received her Masters in Materials Science from Boise State University.<\/p>\n<p>Becky worked at Micron as a process engineer, and now works for Applied Materials, where she manages the on-site team in dry etch.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Becky Cook is a Boise native. She attended the College of Idaho where she received her undergraduate degree. Afterward, she received her Masters in Materials Science from Boise State University.<\/p>\n<p>Becky worked at Micron as a process engineer, and now works for Applied Materials, where she manages the on-site team in dry etch.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Shaheen Dayal\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/10\/Shaheem-Dayal.png\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tShaheen Dayal\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Shaheen Dayal is vice president of customer engagement at Lam Research, where she has responsibility for a top strategic customer account. In this role, Shaheen is responsible for architecting sales strategies and plans across the company to meet the account\u2019s business growth, profitability and customer trust objectives.<\/p>\n<p>Before joining Lam, Shaheen served as vice president for global fab equipment and materials technology sourcing at Intel. She was responsible for Intel\u2019s global fab capital equipment and materials end-to-end supply chain.<\/p>\n<p>Shaheen holds a B.S. and M.S. in electrical engineering from the Massachusetts Institute of Technology (MIT). She has written multiple papers related to semiconductor device physics and holds a U.S. patent in the field.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Shaheen Dayal is vice president of customer engagement at Lam Research, where she has responsibility for a top strategic customer account. In this role, Shaheen is responsible for architecting sales strategies and plans across the company to meet the account\u2019s business growth, profitability and customer trust objectives.<\/p>\n<p>Before joining Lam, Shaheen served as vice president for global fab equipment and materials technology sourcing at Intel. She was responsible for Intel\u2019s global fab capital equipment and materials end-to-end supply chain.<\/p>\n<p>Shaheen holds a B.S. and M.S. in electrical engineering from the Massachusetts Institute of Technology (MIT). She has written multiple papers related to semiconductor device physics and holds a U.S. patent in the field.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Ben Fullmer\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2025\/01\/7e5d4a19-927d-4900-8f09-b18ec462cb77-1152x1440.jpeg\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tBen Fullmer\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Ben Fullmer is currently the Vice President of Global Supply Chain at Intel Corporation. Since he joined the team at Intel almost 8 years ago, he has held various roles in Supply Chain, and managed global teams across the United States, China, Japan, Israel, and Singapore.<\/p>\n<p>Prior to joining Intel, Ben was the director of procurement for an Intel\/Micron joint venture (IM Flash) in Utah. Throughout his career, he has held various positions in purchasing, supply chain, accounting, and finance. He has a Bachelor&#8217;s degree from BYU (ID) in Accounting and an MBA from the University of Utah.<\/p>\n<p>Outside of work, Ben loves spending time with his wife and five kids. He enjoys playing golf, tennis, water-skiing, and basketball.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Ben Fullmer is currently the Vice President of Global Supply Chain at Intel Corporation. Since he joined the team at Intel almost 8 years ago, he has held various roles in Supply Chain, and managed global teams across the United States, China, Japan, Israel, and Singapore.<\/p>\n<p>Prior to joining Intel, Ben was the director of procurement for an Intel\/Micron joint venture (IM Flash) in Utah. Throughout his career, he has held various positions in purchasing, supply chain, accounting, and finance. He has a Bachelor&#8217;s degree from BYU (ID) in Accounting and an MBA from the University of Utah.<\/p>\n<p>Outside of work, Ben loves spending time with his wife and five kids. He enjoys playing golf, tennis, water-skiing, and basketball.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Headshot of Doug Hackler\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/02\/image002.png\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tDoug Hackler\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Doug Hackler serves as president and CEO of American Semiconductor, having co-founded the company in 2001. He is also a co-inventor of Semiconductor-on-Polymer Chip Scale Package technology. At American Semiconductor, Doug maintains overall corporate and operational responsibilities. He is an advocate of advanced packaging and assembly semiconductor industry. Doug is well-known for his commitment to industry development of new ultra-thin and flexible technology.<\/p>\n<p>He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at American Semiconductor, M\/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has multiple patents and patents-pending for conventional and flexible solid state technology.\u00a0 He has also published numerous technical papers. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Doug Hackler serves as president and CEO of American Semiconductor, having co-founded the company in 2001. He is also a co-inventor of Semiconductor-on-Polymer Chip Scale Package technology. At American Semiconductor, Doug maintains overall corporate and operational responsibilities. He is an advocate of advanced packaging and assembly semiconductor industry. Doug is well-known for his commitment to industry development of new ultra-thin and flexible technology.<\/p>\n<p>He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at American Semiconductor, M\/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has multiple patents and patents-pending for conventional and flexible solid state technology.\u00a0 He has also published numerous technical papers. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Lyman Hall\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/10\/Lyman-Hall-1152x1152.jpg\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tLyman Hall\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Lyman Hall has over 20 years experience in the semiconductor industry and currently serves as associate vice president, custom, compute &amp; storage business operations at Marvell Semiconductor Inc., a semiconductor company that specializes in data infrastructure and integrated circuit solutions. Lyman graduated from Brigham Young University with a bachelor\u2019s degree in electrical and computer engineering.\u00a0 He started his career at Extended Systems as a software engineer.\u00a0 In 2001, Lyman joined Agilent Technologies as a software manager before moving on to Marvell in 2006.<\/p>\n<p>Lyman is a seasoned professional with extensive experience in R&amp;D, Business Development, and Program Management. <strong>\u00a0<\/strong>As associate vice president at Marvell Semiconductor<strong>,<\/strong> he has consistently demonstrated exceptional leadership and strategic vision, driving successful projects and fostering strong team dynamics. With a career spanning over 25 years, Lyman has developed a reputation for strategic thinking, collaboration and driving successful execution.\u00a0 His contributions have been instrumental in bringing innovative silicon solutions to the market of the last few decades.\u00a0 Lyman remains committed to continuous learning and professional development.<\/p>\n<p>When he\u2019s not at work, Lyman enjoys spending time with his family and participating in numerous outdoor activities like hiking, camping, fishing, and hunting.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Lyman Hall has over 20 years experience in the semiconductor industry and currently serves as associate vice president, custom, compute &amp; storage business operations at Marvell Semiconductor Inc., a semiconductor company that specializes in data infrastructure and integrated circuit solutions. Lyman graduated from Brigham Young University with a bachelor\u2019s degree in electrical and computer engineering.\u00a0 He started his career at Extended Systems as a software engineer.\u00a0 In 2001, Lyman joined Agilent Technologies as a software manager before moving on to Marvell in 2006.<\/p>\n<p>Lyman is a seasoned professional with extensive experience in R&amp;D, Business Development, and Program Management. <strong>\u00a0<\/strong>As associate vice president at Marvell Semiconductor<strong>,<\/strong> he has consistently demonstrated exceptional leadership and strategic vision, driving successful projects and fostering strong team dynamics. With a career spanning over 25 years, Lyman has developed a reputation for strategic thinking, collaboration and driving successful execution.\u00a0 His contributions have been instrumental in bringing innovative silicon solutions to the market of the last few decades.\u00a0 Lyman remains committed to continuous learning and professional development.<\/p>\n<p>When he\u2019s not at work, Lyman enjoys spending time with his family and participating in numerous outdoor activities like hiking, camping, fishing, and hunting.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Headshot of Michael Howse\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/02\/Michael_Howse_Headshot_17E9705_SQ1_Hi_Res-1152x1152.jpg\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tMichael Howse\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Michael Howse is a technology CEO and investor who constantly drives value creation and profitable growth through innovation. He has 25+ years of experience building and scaling businesses across semiconductors, cloud services, mobile, and computer gaming.<\/p>\n<p>Currently, Michael is currently founder and general partner of Eleven Ventures. This venture capital firm focuses on AI services, cloud platforms and enabling technology companies. These have resulted in exits to AMD, Amazon Web Service and a NASDAQ IPO. Prior to Eleven Ventures, Michael was the corporate vice president of new ventures at AMD. There, he was recruited as a member of the turnaround team. Previously, he was CEO of Bigfoot Networks. He was the Series B CEO, and scaled the Killer branded game networking products. From there, he led the company through its acquisition by Qualcomm. As of today, Killer networking has been distributed in over 150M PCs.<\/p>\n<p>Michael was integral in creating the GPU category while serving in executive roles at Creative Labs, S3 and 3dfx Interactive. As senior vice president of marketing and business development at 3dfx, he conceived and executed the strategy that increased revenue from $20 million to more than $400 million in three years. This was done by creating one of the PCs first major technology brands with the &#8220;Voodoo&#8221; line of 3D game accelerators.<\/p>\n<p>Furthermore, Michael has received industry awards, including \u201cMarketer of the Year\u201d from MC\/Brandweek. He is also a recipient of an Academy of Interactive Arts &amp; Sciences award for his pioneering work at Total Vision, a company he founded. He currently serves on the Executive Committee of the UCLA Venture Capital Fund as a senior advisor to global consulting firm Kearney, as well as board member to multiple startups.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Michael Howse is a technology CEO and investor who constantly drives value creation and profitable growth through innovation. He has 25+ years of experience building and scaling businesses across semiconductors, cloud services, mobile, and computer gaming.<\/p>\n<p>Currently, Michael is currently founder and general partner of Eleven Ventures. This venture capital firm focuses on AI services, cloud platforms and enabling technology companies. These have resulted in exits to AMD, Amazon Web Service and a NASDAQ IPO. Prior to Eleven Ventures, Michael was the corporate vice president of new ventures at AMD. There, he was recruited as a member of the turnaround team. Previously, he was CEO of Bigfoot Networks. He was the Series B CEO, and scaled the Killer branded game networking products. From there, he led the company through its acquisition by Qualcomm. As of today, Killer networking has been distributed in over 150M PCs.<\/p>\n<p>Michael was integral in creating the GPU category while serving in executive roles at Creative Labs, S3 and 3dfx Interactive. As senior vice president of marketing and business development at 3dfx, he conceived and executed the strategy that increased revenue from $20 million to more than $400 million in three years. This was done by creating one of the PCs first major technology brands with the &#8220;Voodoo&#8221; line of 3D game accelerators.<\/p>\n<p>Furthermore, Michael has received industry awards, including \u201cMarketer of the Year\u201d from MC\/Brandweek. He is also a recipient of an Academy of Interactive Arts &amp; Sciences award for his pioneering work at Total Vision, a company he founded. He currently serves on the Executive Committee of the UCLA Venture Capital Fund as a senior advisor to global consulting firm Kearney, as well as board member to multiple startups.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Headshot of Dean Klein\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2023\/03\/D-Klein-e1679001730947.jpg\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tDean Klein\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Dean Klein retired as advanced memory solutions vice president at Micron Technology. There, he was responsible for developing memory technologies and capabilities. He was appointed to this position in August 2016. Mr. Klein joined Micron Technology, Inc. in January 1999, after holding several leadership positions at Micron Electronics, Inc.\u00a0 These included executive vice president of product development and chief technical officer. At Micron, he was most recently vice president of memory system development.<\/p>\n<p>In 1984, Mr. Klein co-founded and served as president of PC Tech Inc., previously a wholly owned subsidiary of Micron Electronics Inc. Mr. Klein earned bachelor&#8217;s and master&#8217;s degrees in electrical engineering from the University of Minnesota. Now, he holds over 270 patents in the areas of computer architecture and electrical engineering. Mr. Klein also has a passion for math and science education. He is a mentor to the BullBots FIRST Robotics team.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Dean Klein retired as advanced memory solutions vice president at Micron Technology. There, he was responsible for developing memory technologies and capabilities. He was appointed to this position in August 2016. Mr. Klein joined Micron Technology, Inc. in January 1999, after holding several leadership positions at Micron Electronics, Inc.\u00a0 These included executive vice president of product development and chief technical officer. At Micron, he was most recently vice president of memory system development.<\/p>\n<p>In 1984, Mr. Klein co-founded and served as president of PC Tech Inc., previously a wholly owned subsidiary of Micron Electronics Inc. Mr. Klein earned bachelor&#8217;s and master&#8217;s degrees in electrical engineering from the University of Minnesota. Now, he holds over 270 patents in the areas of computer architecture and electrical engineering. Mr. Klein also has a passion for math and science education. He is a mentor to the BullBots FIRST Robotics team.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Headshot of Brian Shirley\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2023\/03\/BShirley-e1679001789920.jpg\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tBrian Shirley\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Mr. Brian M. Shirley previously served as senior vice president of DRAM &amp; Emerging Memory Engineering at Micron Technology, Inc.\u00a0 He joined Micron in 1988 as a member of the DRAM Product engineering team.\u00a0 Since then, he has served in many roles including DRAM design manager, vice president of DRAM Solutions and Memory, and vice president of Memory Technology and Solutions at Micron.\u00a0 Additionally, he was also the director of Elpida Memory Inc. and the director at Inotera Memories Inc until July 2014.\u00a0 Mr. Shirley holds a Bachelor of Science degree in Electrical Engineering from Stanford, where he graduated with distinction.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Mr. Brian M. Shirley previously served as senior vice president of DRAM &amp; Emerging Memory Engineering at Micron Technology, Inc.\u00a0 He joined Micron in 1988 as a member of the DRAM Product engineering team.\u00a0 Since then, he has served in many roles including DRAM design manager, vice president of DRAM Solutions and Memory, and vice president of Memory Technology and Solutions at Micron.\u00a0 Additionally, he was also the director of Elpida Memory Inc. and the director at Inotera Memories Inc until July 2014.\u00a0 Mr. Shirley holds a Bachelor of Science degree in Electrical Engineering from Stanford, where he graduated with distinction.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"panel-people__item\">\n\t\t\t\t\t\t\t\n<div class=\"panel-people__media\">\n\t\t<figure   class=\"tribe-image\">\n\t\n\t\t\n\t\t\t\t<img decoding=\"async\" class=\"\"  alt=\"Headshot of Mark Tuttle\" role=\"img\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2023\/03\/MTuttle-e1679001773909.jpg\" \/>\n\t\t\n\t\t\n\t\t\n\n\t\t<\/figure>\n\t<\/div>\n\n<div class=\"panel-people__info\" >\n\t\n<div class=\"panel-people__info__hd\" >\n\t\n<h3\n\t\tclass=\"panel-people__name\"\n\t\t>\n\n\tMark Tuttle\n\n<\/h3>\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--mobile\" >\n\t<p>Mark Tuttle was corporate vice president of Package Technology Development at Micron Technology, Inc., until retirement in August, 2019. Mr. Tuttle has over 40 years of executive, operations, and engineering experience in the semiconductor, RFID, and LED industries. He holds more than 250 US and foreign patents for his technological innovations. Adding to this, his background features leadership and executive positions in several successful startup companies. These include Micron Technology, Micron Communications, and SemiLEDs, with both Micron Technology and SemiLEDs achieving USA stock market IPOs.<\/p>\n<p>Mr. Tuttle has provided operations and manufacturing leadership in a multitude of areas.\u00a0 Some examples are: semiconductor processing and packaging, LED processing and packaging, Wafer Level Packaging, RFID tag and reader manufacturing, and lithium battery manufacturing. In a General Manager capacity, he directed Global Sales and Marketing Departments for both LED chip and package operations, as well as R&amp;D and Development departments. After living abroad for 5 years in Asia, he is very experienced in international business with companies in Taiwan, China, Japan, Malaysia, Korea, and throughout Europe.<\/p>\n<p>Mr. Tuttle has served on a number of academic and corporate boards, including the SemiLEDs Optoelectronic board, SemiLEDs China board. He was chairman of the Boise State University College of Engineering Advisory Board, and member of the University of Idaho Materials Science and Engineering Advisory Council. Mr. Tuttle holds a Bachelor of Science in Chemistry from Boise State University. He authored the chapter, \u201c3D Memory Applications,\u201d in the Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, edited by Garrou, et al., 2008, Wiley-VCH.<\/p>\n\n<\/div>\n\n<div class=\"panel-people__info__ft\" >\n\t\n<\/div>\n\n<\/div>\n\n<div class=\"panel-people__description t-content panel-people__description--desktop\" >\n\t<p>Mark Tuttle was corporate vice president of Package Technology Development at Micron Technology, Inc., until retirement in August, 2019. Mr. Tuttle has over 40 years of executive, operations, and engineering experience in the semiconductor, RFID, and LED industries. He holds more than 250 US and foreign patents for his technological innovations. Adding to this, his background features leadership and executive positions in several successful startup companies. These include Micron Technology, Micron Communications, and SemiLEDs, with both Micron Technology and SemiLEDs achieving USA stock market IPOs.<\/p>\n<p>Mr. Tuttle has provided operations and manufacturing leadership in a multitude of areas.\u00a0 Some examples are: semiconductor processing and packaging, LED processing and packaging, Wafer Level Packaging, RFID tag and reader manufacturing, and lithium battery manufacturing. In a General Manager capacity, he directed Global Sales and Marketing Departments for both LED chip and package operations, as well as R&amp;D and Development departments. After living abroad for 5 years in Asia, he is very experienced in international business with companies in Taiwan, China, Japan, Malaysia, Korea, and throughout Europe.<\/p>\n<p>Mr. Tuttle has served on a number of academic and corporate boards, including the SemiLEDs Optoelectronic board, SemiLEDs China board. He was chairman of the Boise State University College of Engineering Advisory Board, and member of the University of Idaho Materials Science and Engineering Advisory Council. Mr. Tuttle holds a Bachelor of Science in Chemistry from Boise State University. He authored the chapter, \u201c3D Memory Applications,\u201d in the Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, edited by Garrou, et al., 2008, Wiley-VCH.<\/p>\n\n<\/div>\n\n\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\n\t\t\t\t<\/ul>\n\t\t\t<\/div>\n\n\t\t\n\t\t\t\t\n\t\t<\/div>\n<\/div>\n\n\t\t\t<\/div>\n\t\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>The Industry Advisory Board for MERC helps connect the Center and Boise State to the&#8230;<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":15,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-64","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/64","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/comments?post=64"}],"version-history":[{"count":72,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/64\/revisions"}],"predecessor-version":[{"id":2807,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/64\/revisions\/2807"}],"up":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/pages\/15"}],"wp:attachment":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media?parent=64"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}