{"id":660,"date":"2024-08-16T10:27:32","date_gmt":"2024-08-16T16:27:32","guid":{"rendered":"https:\/\/www.boisestate.edu\/microelectronics\/?p=660"},"modified":"2025-11-14T12:57:33","modified_gmt":"2025-11-14T19:57:33","slug":"mer-institute-hosts-event-with-hiroshima-university","status":"publish","type":"post","link":"https:\/\/www.boisestate.edu\/microelectronics\/2024\/08\/16\/mer-institute-hosts-event-with-hiroshima-university\/","title":{"rendered":"MER Institute Hosts Event with Hiroshima University"},"content":{"rendered":"\n<figure class=\"wp-image wp-image--no-caption alignnone\"><img loading=\"lazy\" decoding=\"async\" width=\"300\" height=\"225\" class=\" size-medium wp-image-582\" style=\"\" src=\"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/IMG_2864-1-300x225.jpg\" alt=\"Eight people standing together including Provost of Boise State\"><\/figure><p>The Institute for Microelectronics Education and Research hosted the Memorandum of Understanding signing event with delegates from Hiroshima University as a part of the University Partnership for Workforce Advancement and Research and Development in semiconductors (UPWARDS) program on June 26, 2024.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The Institute for Microelectronics Education and Research hosted the Memorandum of Understanding signing event with&#8230;<\/p>\n","protected":false},"author":3167,"featured_media":582,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[7,12],"tags":[10,9,13],"class_list":["post-660","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-microelectronics-education-and-research","category-upwards","tag-microelectronics-education-and-research","tag-semiconductors","tag-stem-education"],"acf":[],"featured_image_url":"https:\/\/www.boisestate.edu\/microelectronics\/wp-content\/uploads\/sites\/831\/2024\/08\/IMG_2864-1.jpg","author_name":"Taryn Fredrickson","cats":["Microelectronics Education and Research","UPWARDS"],"featured_caption":"","_links":{"self":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/posts\/660","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/users\/3167"}],"replies":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/comments?post=660"}],"version-history":[{"count":8,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/posts\/660\/revisions"}],"predecessor-version":[{"id":2867,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/posts\/660\/revisions\/2867"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media\/582"}],"wp:attachment":[{"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/media?parent=660"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/categories?post=660"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.boisestate.edu\/microelectronics\/wp-json\/wp\/v2\/tags?post=660"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}