3D Technology for Advanced Sensor Systems
A collaboration between our group, RTI International (RTI) and North Carolina State University (NCSU) and includes work in the following areas: advanced metal-metal interconnects, development of process technology for through silicon interconnects, 3D passives, and applications of through silicon vias (TSV) to advanced sensors.
Projects
- Through-wafer interconnect reliability
- Continuity and void detection
- Plasma induced damage (PID)
- Environmental reliability
- TWI Applications
- Device applications & 3D microstructures
Students
Graduate Students
*: 2003 Micron Campus Engineering Research Program (undergraduate summer research)+: Awarded Best Research Poster-College of Engineering at 2004 Boise State University Undergraduate Research Conference
Collaboration
- PI: Professor A. J. Moll (Materials Science & Engineering)
- Dr. Sean Donovan (Materials Science & Engineering)
- Dr. Wan Kuang (Electrical & Computer Engineering)
- Dr. Peter Mullner (Materials Science & Engineering)
- Dr. Megan Frary (Materials Science & Engineering)