Industry Advisory Board

Mr. Brian M. Shirley previously served as Senior Vice President of DRAM & Emerging Memory Engineering at Micron Technology, Inc. Mr. Shirley served as Vice President of Memory Technology and Solutions at Micron Technology, Inc. from April 2014 until June 22, 2017. Mr. Shirley served as Vice President of DRAM Solutions at Micron Technology Inc. from June 2010 and served as its Vice President of Memory since February 2006. He joined Micron in 1988 as a member of the Dram product engineering team. He served as Dram Design Manager of Micron Technology Inc. since 1997. He served as a Director of Elpida Memory Inc. He served as a Director at Inotera Memories Inc. until July 15, 2014. Mr. Shirley holds a bachelor of science in electrical engineering from Stanford University, where he graduated with distinction.

Dean Klein retired as advanced memory solutions vice president at Micron Technology where he was responsible for developing memory technologies and capabilities. He was appointed to this position in August 2016. Mr. Klein joined Micron Technology, Inc. in January 1999, after holding several leadership positions at Micron Electronics, Inc., including executive vice president of product development and chief technical officer. His most recent position at Micron was vice president of memory system development. Mr. Klein also co-founded and served as president of PC Tech Inc., previously a wholly owned subsidiary of Micron Electronics Inc., from its inception in 1984. Mr. Klein earned bachelor’s and master’s degrees in electrical engineering from the University of Minnesota. He holds over 270 patents in the areas of computer architecture and electrical engineering. Mr. Klein also has a passion for math and science education and is a mentor to the BullBots FIRST Robotics team.

Jay and his wife Shelly own Lanae Ridge Vineyard LLC. located in the Sunnyslope region of Canyon County.  He retired from Micron Technology in 2018 after 35 years with the company. While at Micron, he held various leadership positions including Vice President of Operations and Vice President of Consumer Products.  He also served in the roles of President of Micron Italy, Micron Japan and Micron Puerto Rico and also served as Director of Micron Semiconductor Asia.

Jay has served on the Boise State University Foundation Board, the Boise State President’s Advisory Board,, Bronco Athletic Association,  Micron Technology Foundation and Boise Public Schools Education Foundation.  In 2015, Jay received the Boise State University Distinguished Alumni Award.   He recently served as an Adjunct Executive Instructor in the Boise State Executive MBA Program. Jay and Shelly are members of the Lyle Smith Society at Boise State. He has a bachelor’s degree in Marketing from Boise State University.

Mark Tuttle was Corporate Vice President of Package Technology Development at Micron Technology, Inc., in Boise, Idaho, until he retired in August, 2019. Mr. Tuttle has over 40 years of executive, operations, and engineering experience in the semiconductor, RFID, and LED industries, and holds more than 250 US and foreign patents for his technological innovations. His background features leadership and executive positions in several successful startup companies, including Micron Technology, Micron Communications, and SemiLEDs, with both Micron Technology and SemiLEDs achieving USA stock market IPOs. In addition to driving innovation, Mr. Tuttle has provided Operations and Manufacturing leadership in semiconductor processing and packaging, LED processing and packaging, Wafer Level Packaging, RFID tag and reader manufacturing, and lithium battery manufacturing. In a General Manager capacity, he has also directed Global Sales and Marketing Departments for both LED chip and package operations, as well as R&D and Development departments. After living abroad for 5 years in Asia, he is very experienced in international business with companies in Taiwan, China, Japan, Malaysia, Korea, as well as Europe. Mr. Tuttle has served on a number of academic and corporate boards, including the SemiLEDs Optoelectronic board, SemiLEDs China board, and was a chairman of the Boise State University College of Engineering Advisory Board, and member of the University of Idaho Materials Science and Engineering Advisory Council. Mr. Tuttle holds a Bachelor of Science in chemistry from Boise State University, and authored the chapter, “3D Memory Applications,” in the Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, edited by Garrou, et al., 2008, Wiley-VCH.

Michael Howse is a technology CEO and investor with a demonstrated track record of driving value creation and profitable growth through innovation. He has 25+ years of experience building and scaling businesses across semiconductors, cloud services, mobile and computer gaming.

Michael is currently Founder and General Partner of Eleven Ventures, a venture capital firm focused on AI services, cloud platforms and enabling technology companies that has resulted in exits to AMD, Amazon Web Service and a NASDAQ IPO. Prior to Eleven Ventures, Michael served as corporate Vice President of new ventures at AMD, where he was recruited as a member of the turnaround team. Previously, he was CEO of Bigfoot Networks, where he was hired as the Series B CEO, scaled the Killer branded game networking products, and led the company through its acquisition by Qualcomm. Killer networking has been distributed in over 150M PCs.

Michael was integral in creating the GPU category while serving in executive roles at Creative Labs, S3 and 3dfx Interactive. As senior vice president of marketing and business development at 3dfx, he conceived and executed the strategy that increased revenue from $20 million to more than $400 million in three years by creating one of the PCs first major technology brands with the “Voodoo” line of 3D game accelerators.

Mr. Howse has received industry awards, including “Marketer of the Year” from MC/Brandweek and is a recipient of an Academy of Interactive Arts & Sciences award for his pioneering work at Total Vision, a company he founded. He currently serves on the Executive Committee of the UCLA Venture Capital Fund, as a senior advisor to global consulting firm Kearney, as well as board member to multiple startups.

Doug Hackler serves as President and CEO of American Semiconductor, having co-founded the company in 2001, and is a co-inventor of Semiconductor-on-Polymer Chip Scale Package technology. At American Semiconductor Doug maintains overall corporate and operational responsibilities. He is an advanced packaging and assembly semiconductor industry advocate and a leader who is known for his commitment to industry development of new ultra-thin and flexible technology.

He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at American Semiconductor, M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has multiple patents and patents pending for conventional and flexible solid state technology and has published numerous technical papers. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).