Team Synaptic, a multidisciplinary research team from Boise State University, earned a Top 10 Finalist spot in the prestigious Semiconductor Solutions Challenge 2026. Southwest Advanced Prototyping (SWAP) Hub at Arizona State University hosted the event. The final competition and showcase took place on April 3, where finalist teams presented their solutions to a panel of judges.
The national competition brought together more than 150 students from across the United States to address real-world challenges in semiconductor manufacturing and infrastructure. Participants worked on industry-relevant problems, gaining hands-on experience while competing for top recognition.
Team Synaptic earned finalist distinction for its innovative and technically rigorous solutions to two advanced semiconductor problems:
- Polymer Thickness Uniformity Prediction for Semiconductor Packaging
- Automating DRC-Clean Layout for Standard-Cell / Memory Macro Interfaces
The team’s work focused on combining physics-aware modeling, optimization strategies, and designing automation techniques to improve manufacturability and ensure design-rule compliance in modern chip design workflows.
Team Members (Boise State University):
- Ashraf Shihab, PhD Student, Electrical and Computer Engineering
- Asif Bhuiyan, PhD Student, Electrical and Computer Engineering
- Md Mahmudul Kabir Peyal, PhD Student, Electrical and Computer Engineering
- Mostofa Najmus Sakib, PhD Student, Computing
The Semiconductor Solutions Challenge is designed to bridge academia and industry. It engages students in practical problem-solving, connecting them directly with industry professionals, and fostering innovation in semiconductor technologies.
Team Synaptic’s Top 10 finalist recognition underscores their ability to translate advanced research into impactful engineering solutions. Additionally, it highlights Boise State University’s growing role in semiconductor research and innovation.
By Md Mahmudul Kabir Peyal