Services

Structural Characterization

Through the Boise State Center for Materials Characterization (BSCMC,) Idaho Microfabrication Laboratory (IML), Materials Science and Engineering, Physics, Chemistry and Biochemistry, and Geosciences departments, researchers have access to a range of equipment and techniques including: transmission electron microscopy (TEM), x-ray diffraction (XRD), scanning electron microscopy (SEM), including systems equipped with energy dispersive spectroscopy (EDS) and electron backscatter diffraction (EBSD), x-ray photoelectron spectroscopy (XPS), nuclear magnetic resonance (NMR), isotope dilution thermal ion mass spectrometer (ID-TIMS), atomic force microscopy (AFM), laser ablation inductively coupled plasma mass spectrometry (LA-ICPMS), and Raman spectroscopy.

At the Imaging Center at the Center for Advanced Energy Studies (CAES) in Idaho Falls, Boise State researchers can access a local electrode atom probe (LEAP), TEM, SEM, a dual beam SEM/FIB, and a nano-indenter AFM.

Mechanical Testing

Boise State’s mechanical testing capabilities include a hydraulic MTS load frame with high temperature testing capabilities, a bench-top hydraulic MTS load frame, a Zwick test bench for low load testing, microhardness systems, and nanoindentation. At CAES, several hydraulic load frames, a drop weight impact testing system, and microhardness indenter are available.

Thermo-physical Property Measurement

Thermo-physical properties can be studied at Boise State using differential scanning calorimetry (DSC), differential thermal analysis (DTA), thermogravimetric analysis (TGA), combustion element analysis, and electrochemical corrosion analysis.

Electrical and Magnetic Characterization

Boise State’s unique electrical properties characterization relies on an several semiconductor characterization set-ups, one of which allows testing at temperatures under 20 K. For magnetic property measurements, Boise State has a vibrating sample magnetometer (VSM) with temperature control and thin film capabilities.

Materials Processing

Boise State has a number of unique materials processing facilities including spark plasma sintering, hot pressing, a rapid prototype lab, a ceramic MEMS processing lab, a microfabrication center for semiconductor processing, numerous sputtering systems for thin film processing, high energy ball milling for powder processing, a tape casting setup, several high temperature controlled atmosphere furnaces, and inert atmosphere gloveboxes.

Thin Film Characterization

To characterize thin film properties, Boise State researchers use optical profilometry and an x-ray reflectometry system for substrate curvature measurement device.

Contact Us

Interested in the services we provide? Please contact the Micron School of Materials Science and Engineering at materials@boisestate.edu. We are happy to point you in the correct direction so you can get started.