Upwards—Materials and Devices for Memory
In collaboration with Nagoya University, Hiroshima University, and the Rensselaer Polytechnic Institute, Boise State University presents a special event: “UPWARDS — Materials and Devices for Memory.”
This collaboration, born from the Chips and Science Act, involves six U.S. universities, five Japanese universities, and industry partners Micron and TEL (Tokyo Electron Limited). UPWARDS provides advanced training and research opportunities in microelectronics and semiconductor fields.
Speakers for this event include Dr. Dan Lamborn, Janine Rush-Buyers, Dr. Lan Li, Dr. Kenji Ishikawa, Dr. Ravishankar Sundararaman, Ms. Chihiro Watanabe, and Dr. Karthik Srinivasan.