Boise State Center for Materials Characterization

Boise State Center for Materials Characterizatin (BSCMC)

Lab Location

Boise State University, Boise, Idaho

Expertise & Research

Materials characterization of non-organic materials at the micro, nano and atomic scale

BSCMC Home Page

Staff

Dr. Rick Ubic
Director
rickubic@boisestate.edu
(208) 426-2309

Dr. Karthik Chinnathambi
TEM/XRD Research Engineer & Lab Manager
karthikchinnathambi@boisestate.edu
(208) 426-4646

Dr. Nick Bulloss
SEM/EPMA Research Engineer
nicholasbulloss@boisestate.edu
(208) 426-5711
(208) 426-5365

AssetMfr and ModelFieldApplication
Transmission electron microscope (TEM)JEOL JEM-2100 HR with EDS, EELS, ASTAR and Gatan heating/cooling holders.Materials CharacterizationMicrostructural, structural and chemical analysis of materials at atomic level.
Electron Microprobe Microanalzyer (EPMA)CAMECA SXFiveMaterials CharacterizationLight element mapping, interdiffusion in metals and alloys. X-ray mapping and quantitative analysis of trace element s in minerals.
-Provide microstructure and geochronology data.
Field Emission Scanning Electron Microscope (FESEM)FEI TeneoMaterials CharacterizationElemental mapping and analysis.
Scanning Electron Microscope (SEM)Hitachi S-3400N with EDSMaterials CharacterizationResolution to 3-4 nm. Can deterrmine elemental composition of samples with EDS module.
Benchtop X-ray Diffraction (XRD) SystemRigaku MiniFlex 600 with high-speed D/teX detectorMaterials CharacterizationRapid phase identification and quantification, percent (%) crystallinity, crystallite size and strain, lattice parameter refinement, Rietveld refinement, and crystal structure.
X-ray diffraction (XRD) systemBruker AXS D8 Discover with point and HISTAR area detectors.Materials CharacterizationPhase identification and quantification, percent (%) crystallinity, crystallite size and strain, lattice parameter refinement, Rietveld refinement, and crystal structure powders/single crystals.
Thickness, composition, texture and strain analysis of thinfilms/epitaxial layers.
Phase transformation studies via in situ cooling/heating.
Hand-held X-ray flourescent (XRF) analyzerBruker Tracer III SDMaterials CharacterizationHandheld device- non-destructive elemental identification and quantification of most elements from magnesium to uranium.
TEM Ion SlicerJEOL EM-09100ISMaterials CharacterizationPrepares an ultra thin TEM section of a larger material specimen.
Grinding wheelsStruers LaboPol-5, Qty 2Materials CharacterizationGrinding and polishing of samples for microstructural studies using optical, SEM and TEM.
Dimple GrinderGatan Model 656Materials CharacterizationTEM sample preparation.
Precision ion polishing system (PIPS)Gatan 691 with cameraMaterials CharacterizationIon thinning of metals and ceramics for TEM imaging.
Glass knife maker (GKM)Boeckeler Instruments, GKMMaterials CharacterizationFabricate glass knives for the microtome.
Inverted Optical MicroscopeBuehler Versamet 3Materials CharacterizationQuick viewing and imaging of specimens in brightfield, darkfield, polarized light and differential interference contrast.
UltramicrotomeLecia EM UC6, Qty 2Materials CharacterizationRoom temperature TEM sample preparation of soft inorganic and organic materials.
Carbon EvaporatorEmitech K950XMaterials CharacterizationDeposit conductive carbon film for SEM analysis.
Optical MicroscopeLeica DM6000 MMaterials CharacterizationHigh magnification optical microscope with brightfield, dark field and DIC modes to study the surface topography and microstructre of materials. Large area and 3D imaging using power automated mosaic and Z-stacking modules. Surface geometry and texture analysis.
ElectropolisherFischione Model 110Materials CharacterizationElectronpolishing of metals for TEM imaging.
ElectropolisherStruers, Tenupol-3Materials CharacterizationElectronpolishing of metals for TEM imaging.
Rotary Disc cutterSouthbay 360Materials CharacterizationCut cylinders/discs of various diameters for TEM.
Disc punchGatan 659Materials CharacterizationPunch out 3 mm metal disc samples for TEM.
Ion Beam ThinnerGatan Model 691 PIPSMaterials CharacterizationSample preparation for TEM.
Ultrasonic Disk GrinderSouth Bay Technology SonicCut 380Materials CharacterizationSample preparation for TEM.