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Ada County Highway District Chip Sealing Project- June 29, 2023

BOISE STATE PARKING COMMUNICATION

Street Maintenance Beginning June 29, 2023

Boise State University has been notified by the Ada County Highway District of upcoming roadwork/chip sealing on a number of roads across campus. The areas include:

  • University Drive between Broadway Avenue and Capitol Boulevard
  • Beacon Street between Parkcenter Boulevard and Boise Avenue
  • Boise Avenue between Broadway Avenue and Capitol Boulevard
  • Lincoln Avenue Between University Drive and Beacon Street
  • Manitou Avenue Between Beacon Street and Howard Street

Start dates for the roadwork are tentative and dependent upon completion of other projects in the Boise area. The projected start date is Thursday, June 29, 2023.  ACHD has communicated that if roadwork does not begin on June 29th, the work will be delayed and will begin on Monday, July 10, 2023.

ACHD will place “No Parking” signs as an indication that crews will be in the area within the next 24 to 48 hours.  Please do not park in marked areas while the maintenance is occurring and please drive slowly over the newly sealed surface.

What to Expect:

  • Excess chips will be swept up approximately 5 to 10 days after chips are applied.
  • A fog seal will be applied approximately 2 to 3 weeks later.
  • Motorists may experience temporary delays during the chipping activities.

For more information regarding this project, please visit http://www.achdidaho.org/Departments/MO/chipseal.aspx

We thank you in advance for your assistance and cooperation in avoiding the affected areas.
For questions regarding this communication, please call our office at (208) 426-7275.