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Advanced Packaging Technologies for Semiconductor Devices

Ruch Engineering Building, Room 103 1375 University Drive, Boise, ID, United States

Join us at 10:30 AM in MEC 114 for a presentation from Kunal Parekh and Derek Nesbitt, engineers on the Advanced Packaging Technology Development team at Micron. 

National Engineers Week

Founded by NSPE in 1951, EWeek(link is external) (February 18–24, 2024) is dedicated to ensuring a...

College of Engineering E-Week Mixer

Mother Earth Brewing Co. 406 S 3rd St, Boise, ID, United States

Join us for the College of Engineering's E-Week Mixer at Mother Earth Brewing Co. on...

Vacuum Channel Transistors for Harsh Environment Electronics

Micron Engineering Center, Room 114 1020 S Manitou Ave, Boise, ID, United States

Join us at 10:30 AM in MEC 114 for a presentation from Ranajoy Bhattacharya, a Research Scientist in the Electrical and Computer Engineering Department at Boise State University.

Micron Interview Workshop

Micron Business and Economics Building 2360 W University Dr, Boise, United States

Join the College of Engineering and the College of Business and Economics as a recruiter...

Meet an Engineering Student

Ruch Engineering Building, Room 103 1375 University Drive, Boise, ID, United States

Our Boise State University community is invited to meet a real-life College of Engineering student...

Donuts with the Deans

Micron Center for Materials Research 1437 W University Drive, Boise, ID, United States

Celebrate National Engineers Week with Dean Lighty and other members of the College of Engineering...

Matias Troccoli Presents

Micron Engineering Center, Room 114 1020 S Manitou Ave, Boise, ID, United States

Join us at 10:30 AM in MEC 114 for a presentation from Matias Troccoli. 

Cyber-Informed Engineering

Micron Engineering Center, Room 114 1020 S Manitou Ave, Boise, ID, United States

Join us at 10:30 AM in MEC 114 for a presentation from Dr. Sin Ming Loo.