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Meet an Engineering Student

Ruch Engineering Building, Room 103 1375 University Drive, Boise, ID, United States

Our Boise State University community is invited to meet a real-life College of Engineering student...

Advanced Packaging Technologies for Semiconductor Devices

Ruch Engineering Building, Room 103 1375 University Drive, Boise, ID, United States

Join us at 10:30 AM in MEC 114 for a presentation from Kunal Parekh and Derek Nesbitt, engineers on the Advanced Packaging Technology Development team at Micron. 

Faculty Candidate Ankit Mittal Presents

Ruch Engineering Building, Room 103 1375 University Drive, Boise, ID, United States

Join us at 10:55 AM in RUCH 103 for a presentation from ECE Faculty Candidate Ankit Mittal.