Team BOND

Plexus Corporation, a contract manufacturing company, has requested a solution to automate the dispensing process of bonding materials to circuit boards as part of production improvement. Currently, the bonding materials are dispensed manually, but with the high demand of precision and accuracy in addition to a wide variety of circuit board designs, the production can be time consuming, challenging, and error-prone. Team Best On-target Notable Dispenser (BOND) has been asked to design a device that automates the production process with greater efficiency, repeatability, and adaptability for different circuit board designs and bonding materials. Using a sourced robotic arm from Annin Robotics, a syringe system with an additional motor was implemented to dispense the thermal adhesive. A base design was also manufactured to improve stability while providing a universal placement for circuit boards.

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